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24 Layers Communication backplane PCB - UGPCB

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24 Layers Communication backplane PCB

نموذج : 24 Layers Communication backplane PCB

مادة : Panasonic m6

طبقة : 24طبقات

لون : Blue/White

سمك الانتهاء : 2.0مم

سمك النحاس : 1أوقية

المعالجة السطحية : الغمر الذهب

تتبع دقيقة : 6ميل(0.15مم)

Min Space : 6ميل(0.15مم)

characteristic : High multilayer

طلب : communication backplane pcb

  • تفاصيل المنتج

Introduction to the 24 Layers Communication Backplane PCB

ال 24 Layers Communication Backplane PCB is a high-performance printed circuit board designed for complex communication systems. It is engineered to provide robust connectivity and reliable signal transmission, making it ideal for advanced telecommunication applications.

What is a 24 Layers Communication Backplane PCB?

A 24 Layers Communication Backplane PCB refers to a multilayered printed circuit board that has been specifically designed with 24 layers of conductive material separated by dielectric layers. This structure allows for high-density interconnectivity while maintaining signal integrity and minimizing interference.

Design Requirements

The design requirements for a 24 Layers Communication Backplane PCB are stringent due to its application in critical communication systems. Key design considerations include:

  • مادة: Panasonic M6, known for its excellent thermal and electrical properties.
  • Layer Count: 24 layers to accommodate complex routing needs.
  • لون: Blue/White for easy identification and aesthetic appeal.
  • سمك الانتهاء: 2.0mm to ensure structural integrity without being overly bulky.
  • سمك النحاس: 1OZ to provide adequate conductivity.
  • المعالجة السطحية: Immersion Gold to enhance solderability and corrosion resistance.

How Does It Work?

ال 24 Layers Communication Backplane PCB works by using multiple layers of copper traces separated by dielectric materials. These layers are interconnected through plated through-holes (PTHs) or vias, allowing signals to travel between different layers. The immersion gold surface treatment ensures that the copper traces remain conductive and resistant to oxidation.

Applications

The primary application of the 24 Layers Communication Backplane PCB is in communication backplanes where high-speed data transmission and reliable connectivity are crucial. These PCBs are used in:

  • Telecom infrastructure
  • Data centers
  • High-frequency communication devices
  • Networking equipment

تصنيف

Based on its features and applications, ال 24 Layers Communication Backplane PCB can be classified as a high-multilayer PCB. This classification highlights its capability to handle complex and dense circuit designs required for modern communication systems.

Material Composition

The core material used in the 24 Layers Communication Backplane PCB is Panasonic M6, a high-performance laminate material known for its excellent mechanical, thermal, and electrical properties. This material ensures that the PCB can withstand the demands of high-speed communication applications.

Performance Characteristics

The performance characteristics of the 24 Layers Communication Backplane PCB include:

  • High signal integrity
  • Low signal loss
  • Superior thermal management
  • Enhanced mechanical strength
  • Reliable long-term stability

Structural Details

The structural details of the 24 Layers Communication Backplane PCB are as follows:

  • Layer Count: 24 طبقات
  • سمك الانتهاء: 2.0مم
  • سمك النحاس: 1أوقية
  • Minimum Trace Width: 6ميل (0.15مم)
  • Minimum Space Between Traces: 6ميل (0.15مم)
  • المعالجة السطحية: الغمر الذهب

Features and Benefits

The key features and benefits of the 24 Layers Communication Backplane PCB include:

  • High density interconnectivity
  • Excellent signal integrity
  • Robust mechanical construction
  • Reliable long-term performance
  • Aesthetic color options (Blue/White)

Production Process

The production process of the 24 Layers Communication Backplane PCB involves several steps, including:

  1. Material Selection: Choosing high-quality Panasonic M6 material.
  2. Layer Stacking: Arranging the 24 layers with precision.
  3. النقش: Removing excess copper to form the desired trace patterns.
  4. Plating: Applying immersion gold surface treatment.
  5. Assembly: Incorporating PTHs and vias for layer interconnections.
  6. Testing: Ensuring the PCB meets all performance specifications.

Use Cases

ال 24 Layers Communication Backplane PCB is used in various scenarios, such as:

  • High-speed data transmission networks
  • Telecommunication infrastructure projects
  • Advanced networking equipment
  • Data center applications requiring high bandwidth

في ملخص, ال 24 Layers Communication Backplane PCB is a sophisticated and reliable component designed to meet the demanding requirements of modern communication systems. Its high-density design, excellent performance characteristics, and robust construction make it an essential part of any advanced telecommunication setup.

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