36layers high tg backplane pcb

Overview of the 36-Layer High TG Backplane PCB

The 36-Layer High TG Backplane PCB is a high-density, multilayer printed circuit board (ثنائي الفينيل متعدد الكلور) designed for backplane applications. This PCB is ideal for complex electronic systems that need to manage high power and signal integrity.

What is a 36-Layer High TG Backplane PCB?

A 36-Layer High TG Backplane PCB is a printed circuit board (ثنائي الفينيل متعدد الكلور) with 36 layers of conductive material separated by insulating layers, specifically designed for backplane applications. على المدى “High TG” refers to the glass transition temperature, indicating the PCB’s ability to withstand high temperatures without losing its mechanical and electrical properties.

Design Requirements

The design requirements for a 36-Layer High TG Backplane PCB are stringent to ensure its performance and reliability:

مادة: High TG FR4, chosen for its excellent electrical and thermal properties.
Layer Count: 36 layers to accommodate complex and dense circuit designs.
لون: Green/White for easy identification and aesthetic appeal.
سمك الانتهاء: 2.4mm to provide structural integrity and durability.
سمك النحاس: 1OZ to ensure adequate conductivity and heat dissipation.
المعالجة السطحية: Immersion Gold to enhance solderability and corrosion resistance.
Minimum Trace and Space: 4ميل(0.1مم) to support fine circuit patterns.
Characteristic: High multilayer, Panasonic M6 PCB material, known for its high reliability and performance.

How Does It Work?

The 36-Layer High TG Backplane PCB works by providing a platform for various electronic components to be interconnected through conductive pathways. These pathways, or traces, are made of copper and are etched onto the board. The high TG FR4 material ensures that the PCB can withstand high temperatures without losing its mechanical and electrical properties, while the immersion gold surface treatment ensures that these traces remain conductive and resistant to corrosion.

Applications

The primary application of the 36-Layer High TG Backplane PCB is in backplane applications where it manages and regulates the flow of electrical signals. This includes:

Data communication devices
Networking equipment
Industrial control systems
Telecommunication infrastructure

Classification

Based on its features and applications, the 36-Layer High TG Backplane PCB can be classified as a high-speed digital PCB designed for backplane applications. This classification highlights its capability to handle high-frequency signals and provide stable electrical connections.

Material Composition

The core material used in the 36-Layer High TG Backplane PCB is High TG FR4, a high-performance composite material known for its excellent mechanical, thermal, and electrical properties. This material ensures that the PCB can withstand the demands of backplane applications.

Performance Characteristics

The performance characteristics of the 36-Layer High TG Backplane PCB include:

High signal integrity
Low signal loss
Superior thermal management
Robust mechanical strength
Long-term stability

Structural Details

The structural details of the 36-Layer High TG Backplane PCB are as follows:

Layer Count: 36 طبقات
سمك الانتهاء: 2.4مم
سمك النحاس: 1أوقية
المعالجة السطحية: الغمر الذهب
Minimum Trace and Space: 4ميل(0.1مم)
Characteristic: High multilayer, Panasonic M6 PCB material

Features and Benefits

The key features and benefits of the 36-Layer High TG Backplane PCB include:

High density interconnectivity
Excellent signal integrity
Robust mechanical construction
Reliable long-term performance
Aesthetic color options (أخضر/أبيض)

Production Process

The production process of the 36-Layer High TG Backplane PCB involves several steps including:

Material Selection: Choosing high-quality High TG FR4 material.
Layer Stacking: Arranging the 36 layers with precision.
النقش: Removing excess copper to form the desired trace patterns.
Solder Mask Application: Applying a solder mask layer to protect the copper traces.
Plating: Applying immersion gold surface treatment.
Assembly: Incorporating PTHs and vias for layer interconnections.
Testing: Ensuring the PCB meets all performance specifications.