4L 1+N+1 HDI Wifi Module

Introduction to the 4L 1+N+1 HDI Wifi Module Product Overview

The 4L 1+N+1 HDI Wifi Module is a cutting-edge electronic module designed for high-density interconnect applications. This module utilizes advanced technology to ensure reliable and efficient performance in various electronic devices.

Definition

A High-Density Interconnect (مؤشر التنمية البشرية) module refers to a printed circuit board (ثنائي الفينيل متعدد الكلور) that features higher wiring density than traditional PCBs, enabling more compact and complex designs. The “4L 1+N+1” designation indicates a four-layer structure with specific layer configurations.

Design Requirements

The 4L 1+N+1 HDI Wifi Module is meticulously designed to meet stringent requirements:

طبقات: Four layers with a specific stack-up of 1+N+1.
مادة: Made from high-quality FR-4 material.
Thickness: The overall finished thickness of the module is 1.0mm.
سمك النحاس: Features inner copper layers at 1OZ and outer layers at 0.5OZ.
المعالجة السطحية: Incorporates immersion gold and Organic Solderability Preservatives (OSP) for enhanced durability and solderability.
Min Trace/Space: Supports minimal trace and space widths of 4mil.
Min Hole: Accommodates mechanical holes as small as 0.2mm and laser holes as fine as 0.1mm.

مبدأ العمل

The 4L 1+N+1 HDI Wifi Module operates by utilizing high-frequency signals transmitted via its integrated antenna to connect to Wi-Fi networks. The module’s HDI design allows for efficient signal routing and minimal interference, ensuring robust and stable connectivity.

Applications

This versatile module is suitable for a wide range of applications including but not limited to:

الالكترونيات الاستهلاكية: الهواتف الذكية, أقراص, smart home devices.
المعدات الصناعية: Automation systems, control panels.
Communication Devices: Routers, access points, set-top boxes.

Classification

The module falls under the category of high-density interconnect printed circuit boards, specifically tailored for applications requiring compact size and high performance.

Material Composition

Constructed from FR-4, a flame-retardant glass-reinforced epoxy laminate, the module ensures excellent thermal and electrical properties. The copper layers provide conductive pathways essential for signal transmission.

Performance Characteristics

Signal Integrity: Maintains high signal integrity due to minimized trace lengths and optimized layer stack-up.
Thermal Management: Efficient heat dissipation thanks to the material properties of FR-4 and the design architecture.
Durability: Enhanced durability with surface treatments like immersion gold and OSP, protecting against oxidation and improving solder joint reliability.

Structural Features

Quadrilateral Foramen: A specialized process involving the creation of square-shaped holes, allowing for intricate component placement and routing.
Layer Stack-Up: The unique 1+N+1 layer arrangement optimizes space utilization and signal integrity.

Production Process

The manufacturing process involves several key steps:

Material Preparation: Cutting and preparing the FR-4 substrate.
Copper Lamination: Applying copper layers on both sides and inner layers as per design.
النقش: Removing excess copper to form the desired circuit patterns.
Layer Alignment: Stacking and aligning the layers accurately.
Bonding: Using heat and pressure to bond the layers together.
المعالجة السطحية: Applying immersion gold and OSP finishes.
ضبط الجودة: Conducting thorough inspections and tests to ensure product quality.

Use Case Scenarios

الالكترونيات الاستهلاكية

In smartphones and tablets, the 4L 1+N+1 HDI Wifi Module ensures reliable wireless connectivity while maintaining a slim profile.

المعدات الصناعية

For automation systems, the module provides dependable communication links in harsh industrial environments.

Communication Devices

In routers and access points, the module enhances network performance with its superior signal handling capabilities.

By adhering to these design and production standards, the 4L 1+N+1 HDI Wifi Module delivers exceptional performance and reliability, making it an ideal choice for modern electronic applications.