8 Layer RF PCB Rogers RO4350B + FR4 Hybrid Board

RO4350B Ceramic Hybrid High Frequency PCB Overview

The RO4350B Ceramic Hybrid High Frequency PCB is a cutting-edge printed circuit board designed for high-performance applications in the communication industry. Combining the robustness of Rogers RO4350B material with the versatility of FR4, this PCB offers exceptional electrical and thermal properties, making it ideal for high-frequency circuits.

Material Composition

The RO4350B Ceramic Hybrid High Frequency PCB is crafted from a unique blend of Rogers RO4350B and FR4 materials, pressed together to create a robust and reliable substrate. This mix ensures a balance of electrical performance and cost-effectiveness, making it suitable for a wide range of applications.

Performance Characteristics

• Layer Count: The PCB features an 8-layer design, providing ample space for complex circuitry and components.
• Dielectric Constant (D K): With a D K of 3.48, the board exhibits stable electrical performance across a wide frequency range.
• سمك الانتهاء: The PCB has a finished thickness of 2.5mm, ensuring durability and structural integrity.
• سمك النحاس: The 1oz copper thickness offers excellent conductivity and current carrying capacity.
• Dielectric Thickness: The dielectric layer is 0.338mm thick, contributing to the board’s overall electrical performance.
• Thermal Conductivity: With a thermal conductivity of 0.69w/m.k, the PCB effectively manages heat dissipation, preventing overheating and component failure.
• Flammability: The board meets the 94V-0 flammability rating, ensuring safety in various environments.

Production Process

The production of RO4350B Ceramic Hybrid High Frequency PCBs involves several precision steps:

1. Material Preparation: Rogers RO4350B and FR4 materials are carefully selected and prepared for mixing.
2. Mixing and Pressing: The materials are blended and pressed together under controlled conditions to form a uniform substrate.
3. Circuit Design and Layout: The desired circuit patterns are designed and laid out using advanced CAD software.
4. Manufacturing: The PCB is manufactured through a series of processes including etching, drilling, and copper plating.
5. المعالجة السطحية: The board undergoes immersion gold surface treatment to enhance conductivity and corrosion resistance.
6. ضبط الجودة: Each PCB undergoes rigorous testing to ensure it meets the specified performance standards.

Application Scenarios

The RO4350B Ceramic Hybrid High Frequency PCB is ideal for use in communication instruments, including:

• High-Frequency Circuits: The PCB’s exceptional electrical properties make it suitable for high-frequency circuits in radio and microwave systems.
• Antenna Arrays: Its robust design and stable performance support the operation of complex antenna arrays in communication networks.
• Signal Processing Units: The PCB’s ability to handle high-speed signals ensures reliable performance in signal processing units.

في ملخص, the RO4350B Ceramic Hybrid High Frequency PCB is a versatile and high-performance solution for communication instruments, offering a combination of electrical excellence, thermal management, والمتانة.