Communication motherboard Turnkey PCB Assembly

تشتمل الجبيرة الهجينة عالية التردد على لوحة قاعدة, والتي يتم طيها ووضعها على طبقة السلك الداخلية الأولى, طبقة السلك الخارجي الأولى, and the top surface of the solder mask ink layer from bottom to top in order. The positioning circuit layer, the second outer wire layer, and the bottom surface of the substrate follow. The substrate includes a second layer of solder resist ink. The substrate comprises a high-frequency area and an auxiliary area; the auxiliary area is fixed, and the high-frequency area inlay should be positioned accordingly.

يوفر نموذج المنفعة جبيرة هجينة عالية التردد, divided into two parts: منطقة عالية التردد ومنطقة مساعدة, providing mechanical support. The high-frequency area is independently arranged and only made of high-frequency materials. This minimizes the use of high-frequency board materials and reduces production costs while satisfying high-frequency signal requirements.

High Frequency Hybrid Product Classification: