شعار UGPCB
F4B-N and F4B-T Teflon Woven Glass Fabric Copper-Clad Laminates
Introduction to F4B-N and F4B-T
F4B-N and F4B-T Teflon woven glass fabric copper-clad laminates are essential materials for manufacturing Teflon woven glass fabric copper-clad laminates. The production process involves dipping treatment of the Teflon resin on alkali-free woven glass fabric, followed by drying, baking, and sintering to formulate the microwave material. These products are characterized by heat resistance, insulation, low loss, excellent electrical performance, and non-adhesion properties. They are widely used in various industries including electronics, motors, الطيران, textiles, chemicals, and food. In microwave devices, they serve as bonding films for multilayer printed circuit boards.
Types of F4B-N and F4B-T Materials
- Anti-Sticking Teflon Woven Glass Fabric: F4B-N
- Ventilated Teflon Woven Glass Fabric: F4B-T
Technical Specifications of F4B-N and F4B-T
Appearance
The surface is smooth and neat with uniform glue discharge and no mechanical damage.
Dimensions (مم)
- Length: A=100~200 mm
- Width: B=900~4000 mm
- Thickness:
- F4B-N: 0.08, 0.10, 0.15, 0.40 مم
- F4B-T: 0.04, 0.07 مم
- Tolerance:
- ±0.01 mm for F4B-N
- ±0.015 mm for F4B-T
- ±0.02 mm for F4B-N
- ±0.04 mm for F4B-T
- ±0.004 mm for F4B-N
- ±0.005 mm for F4B-T
Mechanical, Chemical, and Electrical Properties
| اسم | Test Condition | Unit | Value |
|---|---|---|---|
| Tensile Strength | Tensile Machine | N(±5%) | 8 |
| Operating Temperature | In Oven | degree Celsius | 250°C long-term, 300°C discontinuous |
| Chemical Properties | Dip in Acid, Alkali and Salt | All Inert | |
| Surface Resistance Coefficient | Normal Temperature | Ω | ≥10^12 |
| Volume Resistance Coefficient | Normal Temperature | Ω·cm | ≥1*10^13 |
| Breakdown Voltage | Various Thicknesses | KV | ≥0.6 to ≥1.5 |
| Dielectric Constant | 1GHz | εr | 2.7±0.1 |
| Dissipation Factor | 1GHz | tgδ | ≤2×10^-4 |
For more information or to request F4B-N/F4B-T Teflon PCBs, please contact us.
