شعار UGPCB
Microwave Circuit Design Advantages Using TP-1/2
Stable Dielectric Constant and Operating Temperature
The dielectric constant of TP-1/2 is stable and can be customized within the range of 3.0 ل 22.0, depending on the specific requirements of the circuit design. The operating temperature ranges from -100 degrees Celsius to +150 degrees Celsius.
Reliable Peel Strength and Lower Manufacturing Costs
TP-1/2 offers a more reliable peel strength between copper and the substrate compared to vacuum film coating on ceramic substrates. This makes it easier for customers to process circuits with higher pass rates and significantly lower manufacturing costs than ceramic substrates.
Low Dissipation Factor and Mechanical Manufacturability
TP-1/2 has a dissipation factor (tgδ) of ≤1*10^-3, with minimal variation as frequency increases. It is also easily machinable through processes such as drilling, اللكم, grinding, قطع, and etching, which are not possible with ceramic substrates.
Technical Specifications of TP-1/2
Appearance
Smooth and neat on both sides: no stains, scratches, or dents.
Dimension and Tolerance
- Dimensions (A*B in mm): 120100, 150150, 160160, 180180, 200200, 170240
- Tolerance: -2
- Thickness and Tolerance: 0.8±0.05, 1.0±0.05, 1.2±0.05, 1.5±0.06, 2.0±0.075, 3.0±0.10, 4.0±0.10, 5.0±0.12, 6.0±0.12, 10.0±0.2
- Customized Lamination: Available for special dimensions.
Mechanical Strength
- Peel Strength:
- Normal state: ≥6N/cm
- In alternating humidity and temperature: ≥4 N/cm
Chemical Property
The chemical etching method used for PCB can be applied without altering the dielectric properties of the materials.
Electrical Property
| اسم | Test Condition | Unit | Value |
|---|---|---|---|
| Density | Normal state | g/cm³ | 1.0～2.9 |
| Moisture Absorption | Dip in distilled water at 20±2°C for 24 hours | % | ≤0.02 |
| Operating Temperature | High-low temperature chamber | °C | -100～+150 |
| Thermal Conductivity | -55~288°C | W/m/k | 0.6 |
| CTE | Temperature rise of 96°C per hour | ppm/°C | ≤6*10^-5 |
| Shrinkage Factor | 2 hours in boiling water | % | 0.0004 |
| Surface Resistivity | 500V DC, normal state | MΩ | ≥1*10^7 |
| Volume Resistivity | Normal state | MΩ·cm | ≥1*10^9 |
| Pin Resistance | 500V DC, normal state | MΩ | ≥1*10^6 |
| Surface Dielectric Strength | Normal state | Kv/mm | ≥1.5 |
| Dielectric Constant | 10GHZ | εr | 3,6,9.6,10.2,10.5,11,16,20,22(±2%) (customizable) |
| Dissipation Factor | 10GHZ | Tgδ(εr 3-11) | ≤1*10^-3 |
| Dissipation Factor | Tgδ(εr 12-22) | ≤1.5*10^-3 |
