و,ثنائي الفينيل متعدد الكلور, تخصيص PCBA وPECVD, النماذج الأولية والتصنيع المنتج

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TU-768 High Speed Digital (HSD) PCB Materials

High-Tg and High Thermal Reliability Laminate and Prepreg

Core: TU-768; Prepreg: TU-768P

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (الهيئة العربية للتصنيع) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

Main Applications

  • الالكترونيات الاستهلاكية
  • Server, workstation
  • السيارات

Key Features

  • Lead Free process compatible
  • Excellent coefficient of thermal expansion
  • Anti-CAF property
  • Superior chemical and thermal resistance
  • Fluorescence for AOI
  • Moisture resistance

Property

Typical Values Specifications
تيراغرام (DMA) 190°C
تيراغرام (DSC) 180°C
تيراغرام (TMA) 170°C
Td (TGA) 340°C
CTE z-axis (50 ل 260 °C) 2.7%
T-260/ T288 >60 min/ >15 min
Permittivity @1GHz(RC 50%) 4.3
Loss Tangent @1GHz(RC 50%) 0.018

Industry Approvals

  • IPC-4101E Type Designation: /98, /99, /101, /126
  • IPC-4101E/126 Validation Services QPL Certified
  • UL DesignationANSI Grade: FR-4.0
  • UL File Number: E189572
  • Flammability Rating: 94V-0
  • Maximum Operating Temperature: 130°C

Standard Availability

  • Thickness: 0.002[0.05مم] to 0.062”[1.58مم], available in sheet or panel form
  • Copper Foil Cladding: 1/8 to 12oz (HTE) for built-up; 1/8 to 3oz (HTE) for double sides and H to 2oz (MLS)
  • Prepregs: Available in roll or panel form
  • Glass Styles: 106, 1080, 2113, 2116, 1506 و 7628 إلخ.

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