شعار UGPCB
Product Composition and Applications
WL-CT350 is made of organic polymer, ceramic filler, and glass fiber cloth through scientific preparation and strict process. It is a thermosetting material, and its performance is comparable to similar foreign products. It is suitable for 4G, 5ز, base station antennas, automotive radars and sensors, power amplifiers, microwave devices, high-reliability radars, military communication devices, satellite tuner, إلخ.
WL-CT350 Product Parameters
Exterior and Model Number
Meet the requirements of the national military standard for microwave printed circuit substrate materials.
Model number: WL-CT350
Dielectric Constant and Dimensions
Dielectric constant (10GHZ): 3.48±0.05. Dielectric loss tangent value (10GHZ): 0.004.
Dimensions(مم): 610460, 600500, 915*1224. Special size can be pressed according to customer requirements.
Copper Foil Optional Specifications and Thickness
Forward copper foil: 0.5أوقية, 1 أوقية.
Media thickness (مم): 0.102, 0.168, 0.254, 0.338, 0.422, 0.508, 0.762, 1.016, 1.524.
Tolerance (مم): ±0.01, ±0.015, ±0.02, ±0.03, ±0.03, ±0.03, ±0.05, ±0.05, ±0.08. Special thickness can be customized: starting from 0.508mm thickness, increasing with 0.0838mm thickness.
Mechanical Behavior
Copper foil peeling strength(10Z): WL-CT350 – 9N/cm.
Thermal Stress: Dip tin, 280 degree Celsius*10s, ≧3 times, no delamination, no blistering.
Chemical Properties
According to the characteristics of the substrate, the circuit can be processed by referring to the chemical corrosion method of the printed circuit, and the dielectric properties of the material will not change.
Physical Electrical Properties
Indicator Name and Test Conditions
تيراغرام (TMA): >280 degree Celsius. Td (TGA): 386 degree Celsius. Proportion (Normal): 1.9. Water absorption (Soak in distilled water at 20±2 degree Celsius for 24 hours): 0.05%. Operating temperature (High and low temperature box): -50～+260 degree Celsius. Thermal conductivity: 0.70 Kcal/mh degree Celsius. Thermal expansion coefficient (Typical value, -55 º～288ºC): X=11 ppm/ºC, Y=14 ppm/ºC, Z=34 ppm/ºC. Surface insulation resistance (500V DC, Normal): ≥4108 M.Ω. Constant heat and humidity: ≥1107 M.Ω. Volume resistance (Normal): ≥1109 MΩ.cm. Constant heat and humidity: ≥1108 MΩ.cm. Temperature Coefficient of Dielectric Constant (-50 º～150ºC): 52 PPM/ºC. Dielectric loss tangent (2.5GHZ tgδ): 0.0032. Dielectric loss tangent (10GHZ tgδ): 0.0040. Flame retardant: 94V-0.
WL-CT350 Features
Superior Material Composition
Organic polymer ceramic fiberglass cloth is a thermosetting resin system, which has better hardness than PTFE thermoplastic resin system and has a good loss value.
Stable DK and DF Values
The values of DK and DF are stable, and DK/DF changes little as the frequency increases.
Excellent Electrical and Thermal Conductivity
Excellent electrical performance, excellent thermal conductivity, better insulation performance, and heat treatment ability than PTFE materials.
Compatibility with FR-4 Processing Technology
Compatible with FR-4 processing technology, without plasma treatment, processing technology is relatively simple, compatible with most PP sheets, PCB processability is excellent, especially suitable for PCB multi-layer board processing.
Improved Reliability and Dimensional Stability
The low thermal expansion coefficient improves the reliability and dimensional stability of plated through holes.
Lead-Free Soldering Process Compatibility
Especially suitable for lead-free soldering process.
