PCB-Reverse-Engineering

As a leading global provider of PCB (Leiterplatte) design and manufacturing services, UGPCB’s website features a PCB Reverse Engineering section that emphasizes technical depth and compliance. This section offers comprehensive solutions for corporate clients from reverse analysis to mass production. Below are the core contents and highlights of this section.

1. Service Offerings and Core Technologies

UGPCB’s reverse engineering services encompass multilayer boards, High-Density Interconnection (HDI) boards, flexible boards (FPC), and special material PCBs (such as aluminum-based and high-frequency boards), supporting the precise reconstruction of complex circuit boards from 1 Zu 24 Schichten. The core technologies include:

Physical Layer Reverse Analysis: Utilizing high-precision scanning and image processing technologies to extract the interlayer structures, routing layouts, and pad parameters of PCBs, with an error control of ±0.05mm.
Component and Code Analysis: Supporting firmware extraction and functional simulation for chips such as MCU, DSP, and FPGA, compatible with mainstream brands like STM32, Xilinx, and TI series, ensuring smooth hardware and software integration.
Design Optimization: Enhancing performance based on the original design, including signal integrity optimization, EMC/EMI protection enhancement, and lifecycle cost control.

2. Standardization of the Reverse Engineering Process

UGPCB adopts internationally recognized reverse engineering processes to ensure efficiency and reliability:

Sample Receipt and Evaluation: Clients provide physical PCB samples or Gerber files, which are evaluated by our technical team for reverse feasibility (z.B., RF component compatibility).
Layered Scanning and Modeling: Generating three-dimensional point cloud data through non-destructive layered techniques and reconstructing the PCB model using CAD tools (such as Allegro and PADS).
BOM and Schematic Generation: Extracting the Bill of Materials (Stückliste) and reverse-engineering circuit logic to output editable EDA files.
Prototype Verification and Mass Production: Offering PCB prototype sampling and error correction services, with support for both small batch and large-scale production.

3. Technical Advantages and Compliance Commitment

Integrated Toolchain: Utilizing industry-leading software (such as ImageWare and QuickForm) along with proprietary algorithms to achieve high-precision surface modeling and PCB impedance control (± 5%).
Intellectual Property Protection: Strictly adhering to international patent regulations, providing patent-evading design services to mitigate risks of design and functionality infringement.
Quality Certification System: Achieving ISO 9001, IATF 16949 certifications to ensure products conform to RoHS and UL standards.

4. Application Areas and Case Studies

UGPCB’s reverse engineering services are widely applied in:

Industrial Control Equipment: Replacement of PCBs in older equipment and functional upgrades.
Medical Electronics: Circuit repair and domestic alternatives for precision devices like CT machines and ultrasound instruments.
Kfz -Elektronik: Compatibility design and rapid iteration for onboard ECUs and Battery Management Systems (BMS).

5. Customer Support and Assurance

Confidentiality Agreement: NDA agreements are signed, ensuring full data encryption during transmission.
Technical Consulting: Providing additional services such as chip decryption and code migration, mit einer Reaktionszeit von weniger als 24 Std..
Globales Liefernetz: Verweilen Sie sich auf Produktionsbasis im Chinas Pearl River Delta und im Yangtse River Delta, Unterstützung der schnellen Logistik in Europa, Amerika, und Südostasien.

Durch den Abschnitt "Reverse Engineering", UGPCB hilft nicht nur Unternehmen bei der Erreichung der technologischen Wiederverwendung und der Produkt -Iteration, sondern steuert auch die Transformation der PCB. Die technischen Funktionen und das Service-System wurden durch langfristige Zusammenarbeit mit zahlreichen globalen Kunden validiert.