10Layers Red Color PCB

Introduction to 10L Blind & Buried Hole PCB

The 10L Blind & Buried Hole PCB is a high-density interconnect (HDI) printed circuit board designed for complex electronic applications. This PCB features blind and buried hole technologies, which allow for intricate internal connections without compromising surface real estate. It is suitable for demanding applications requiring advanced functionality and reliability.

Purpose and Applications

Digital PCB

Primarily used in digital circuits, the 10L Blind & Buried Hole PCB ensures reliable connectivity and data transmission in critical electronic setups. Its robust design makes it ideal for applications requiring high signal integrity and durability.

Classification and Materials

FR4 Material

Constructed from FR4, this PCB offers excellent thermal stability and mechanical strength. The 1OZ copper thickness enhances conductivity and heat dissipation, making it suitable for high-performance applications.

Performance and Specifications

Layer Structure and Special Processes

The PCB consists of 10 layers with a unique layer structure: [specific layer structure details if provided]. It incorporates blind and buried holes, which allow for complex internal connections without compromising the board’s surface real estate. The minimum hole size is 0.2mm (8Mil), accommodating fine-pitch components.

Surface Treatment and Trace/Space

The surface treatment is immersion gold, providing good solderability and corrosion resistance. The trace/space configuration is 2.5mil/2.5mil, ensuring precise and dense circuitry layout.

Production Process

Steps Involved in Manufacturing

1. Material Preparation: FR4 boards are cut to the required dimensions.
2. Layer Stacking: The layers are stacked according to the specified structure.
3. Drilling: Blind and buried holes are drilled with precision.
4. Plating: The holes are plated to create electrical connections between layers.
5. Etching: Unnecessary copper is removed to form the desired circuit pattern.
6. Oberflächenbehandlung: The board undergoes immersion gold treatment for enhanced solderability.
7. Inspection: Each board is thoroughly inspected to ensure quality and compliance with specifications.

Key Features and Benefits

Advanced Technology Integration

The integration of blind and buried holes allows for more complex and compact designs, reducing the overall size of the PCB while maintaining high functionality.

High Reliability and Durability

The use of FR4 material ensures that the PCB can withstand high temperatures and harsh conditions, making it reliable for long-term use.

Enhanced Signal Integrity

The 1OZ copper thickness and precise trace/space configuration contribute to superior signal integrity, crucial for digital applications where data accuracy is paramount.

Use Cases and Scenarios

Digital Circuits

In digital circuits, the 10L Blind & Buried Hole PCB provides a stable platform for various electronic components, ensuring seamless operation and data protection.

Industrial Automation

For industrial automation, this PCB supports high-speed data transfer and robust connectivity essential for controlling machinery and monitoring processes efficiently.

Aerospace and Defense

In aerospace and defense applications, the PCB’s high thermal stability and reliability make it suitable for mission-critical equipment and systems.

Abschluss

The 10L Blind & Buried Hole PCB stands out as a high-performance solution for complex electronic applications, especially in digital circuits. Its advanced features, robust materials, and precise manufacturing process ensure reliability and efficiency in demanding environments.