UGPCB-LOGO
Structure and Composition
Base Plate and Layers
The high-frequency hybrid splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from bottom to top. The second layer of the solder resist ink layer is also present.
Substrate Divisions
The substrate includes a high-frequency area and an auxiliary area. The auxiliary area is fixed, und das Inlay im Hochfrequenzbereich sollte sich in einer festen Position befinden.
Utility Model and Design
Division of Splint
Das Versorgungsmodell bietet eine hochfrequente Hybridschiene, die in zwei Teile unterteilt ist: ein Hochfrequenzbereich und ein Hilfsbereich. Es bietet mechanische Unterstützung.
Hochfrequenzbereichsanordnung
The high-frequency area is independently arranged, und nur das Hochfrequenzbereich besteht aus Hochfrequenzmaterialien. This minimizes the use of high-frequency board materials and reduces production costs while satisfying high-frequency signals.
Product Specifications
Classification and Layers
- High Frequency Hybrid Product Classification Layers: 6 Schichten
Board Material and Thickness
- Used Board: ro4350b + FR4
- Dicke: 1.6mm
Size and Surface Treatment
- Größe: 210mm*280mm
- Oberflächenbehandlung: Gold-plated
Minimum Aperture and Application
- Minimum Aperture: 0.25mm
- Anwendung: Kommunikation
Merkmale
- High Frequency Mixed Pressure
