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6-layer 1-stage HDI PCB - UGPCB

HDI PCB/

6-layer 1-stage HDI PCB

Name: 6-layer 1-stage HDI PCB

Schichten: 1+N+1

Blatt: FR4 Tg150

Plattenstärke: 1.6mm

Panel size 105*95mm/1

Outer copper thickness: 35μm

Inner layer copper thickness: 30μm

Minimum through hole: 0.20mm

Minimum blind hole: 0.10mm

Minimum BGA: 0.20mm

Line width line spacing: 3/3Mil

  • Produktdetails

General Description

Construction and Materials

  • Rigid Flex PCB: A 6-layer design incorporating blind and buried vias.
  • Rigid Materials: Constructed from FR4 and DuPont polyimide, known for their good flexural properties.
  • Rigid Area Thickness: 0.6 mm, providing good strength to the board.
  • Laminate Sources: All laminates sourced from authorized dealers under XPCB inspection.

Surface Finish

ENIG Finish Benefits

  • Excellent Surface Flatness: Ensures a smooth and even surface.
  • Good Oxidation Resistance: Protects against degradation over time.
  • Suitable for Movable Contacts: Ensures reliable performance in dynamic applications.

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