6L Hybrid RO3003 + FR4 PCB for Radar System

RO3003 Ceramic Hybrid High Frequency PCB Overview

The RO3003 Ceramic Hybrid High Frequency PCB is a premium printed circuit board designed specifically for high-frequency applications. It combines the advanced electrical properties of Rogers RO3003 material with the cost-effectiveness and versatility of FR4, creating a robust and reliable substrate. This PCB is ideal for guided wave radar level gauges (GWRLGs) and other high-performance applications.

Material Composition

The RO3003 Ceramic Hybrid High Frequency PCB is crafted from a unique blend of Rogers RO3003 and FR4 mixed dielectric materials. This combination offers a balance of electrical performance, cost, und Zuverlässigkeit, making it suitable for a wide range of high-frequency applications.

Performance Characteristics

• Layer Count: The PCB features a 6-layer design, providing ample space for complex circuitry and components.
• Dielectric Constant (D K): With a D K of 3.00 ± 0.04, the board exhibits consistent electrical performance across a wide frequency range.
• Fertige Dicke: The PCB has a finished thickness of 2.0mm, ensuring durability and structural integrity.
• Kupferdicke: The 1oz copper thickness offers excellent conductivity and current carrying capacity.
• Dielektrikumsdicke: The dielectric layer is 0.762mm thick, contributing to the board’s overall electrical performance.
• Wärmeleitfähigkeit: With a thermal conductivity of 0.43w/m.k, the PCB effectively manages heat dissipation, preventing overheating and component failure.
• Flammability: The board meets the 94V-0 flammability rating, ensuring safety in various environments.
• Oberflächenbehandlung: The immersion gold surface treatment enhances conductivity and corrosion resistance, ensuring reliable performance over time.

Production Process

The production of RO3003 Ceramic Hybrid High Frequency PCBs involves several precision steps:

1. Material Preparation: Rogers RO3003 and FR4 materials are carefully selected and prepared for mixing.
2. Mixing and Laminating: The materials are blended and laminated together under controlled conditions to form a uniform substrate.
3. Circuit Design and Layout: The desired circuit patterns are designed and laid out using advanced CAD software.
4. Manufacturing: The PCB is manufactured through a series of processes including etching, drilling, and copper plating.
5. Oberflächenbehandlung: The board undergoes immersion gold surface treatment to enhance conductivity and corrosion resistance.
6. Qualitätskontrolle: Each PCB undergoes rigorous testing to ensure it meets the specified performance standards.

Application Scenarios

The RO3003 Ceramic Hybrid High Frequency PCB is ideal for use in guided wave radar level gauges (GWRLGs), where high-frequency performance and reliability are critical. The PCB’s exceptional electrical properties and robust design make it suitable for the following applications:

• High-Frequency Signal Transmission: The PCB supports high-frequency signal transmission with minimal loss, ensuring accurate and reliable level measurement.
• Complex Circuitry: The 6-layer design provides ample space for complex circuitry and components, enabling advanced functionality and performance.
• Harsh Environments: The PCB’s durability and flame resistance make it suitable for use in harsh environments, ensuring reliable performance even in challenging conditions.

Zusammenfassend, the RO3003 Ceramic Hybrid High Frequency PCB is a versatile and high-performance solution for guided wave radar level gauges and other high-frequency applications. Its combination of electrical excellence, durability, and reliability makes it an ideal choice for demanding applications.