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Anylayer HDI 10Layer PCB - Und

HDI PCB/

Anylayer HDI 10Layer PCB

Modell : Anylayer HDI 10Layers PCB board

Material:IT180A

Schicht :10Layers anylayer

Farbe :Green /White

Fertige Dicke:1.6m

Kupferdicke :inner1OZ outer0.5OZ

Oberflächenbehandlung :Immersionsgold + OSP

Min. Spur / Raum :2.5mil/2.5mil

Min HoleMechanical hole 0.2mmLaser Hole 0.1mm

Anwendung :Communication Products pcb

Specail Process: Anylayer hdi pcb

  • Produktdetails

Introduction to the Anylayer HDI 10Layers PCB Board

The Anylayer HDI 10Layers PCB board is a sophisticated high-density interconnect (HDI) Leiterplatte (Leiterplatte) designed for advanced communication products. This guide will cover its definition, design requirements, working principles, applications, classification, materials, performance, structure, features, Produktionsprozess, and typical use cases.

Definition and Design Requirements

Modell: Anylayer HDI 10Layers PCB Board
This model refers to a ten-layer PCB featuring anylayer HDI technology, allowing for complex internal layer connections.

Material: IT180A
The base material used is IT180A, known for its excellent thermal stability, mechanical strength, and flame resistance.

Layer Composition: 10 Layers Anylayer
This indicates a ten-layer structure with flexible internal layer connectivity, optimizing signal integrity and power distribution.

Fertige Dicke: 1.6mm
The total thickness of the finished PCB is 1.6 millimeters, ensuring durability while maintaining flexibility for various applications.

Kupferdicke: Inner 1OZ, Outer 0.5OZ
The copper traces on inner layers have a thickness of 1 ounce (oz), whereas the outer layers feature a thinner 0.5 oz copper, balancing conductivity and space efficiency.

Working Principle and Purpose

Oberflächenbehandlung: Immersionsgold + OSP
To enhance solderability and protect against oxidation, the PCB undergoes immersion gold plating on critical areas and organic solderability preservatives (OSP) on others.

Minimum Trace/Space: 2.5mil/2.5mil
The PCB supports fine pitch components with a minimum trace width and spacing of 2.5 mils (thousandths of an inch), facilitating compact designs without compromising performance.

Min Hole Diameter: Mechanical Hole 0.2mm, Laser Hole 0.1mm
It accommodates small components through mechanical drilling down to 0.2mm and even finer laser-drilled holes at 0.1mm, enabling high-density integration.

Anwendung: Communication Products PCB
Primarily tailored for communication products, this PCB ensures reliable signal transmission and minimal interference, crucial for maintaining clear and consistent data flow in telecommunication devices.

Classification and Materials

Classification: High-Density Interconnect (HDI) Leiterplatte
As an HDI PCB, it belongs to a category of boards specifically engineered for complex electronic devices that require intricate routing and component placement.

Material: IT180A
IT180A is a composite material widely used in PCB manufacturing due to its balance of electrical properties, thermal resistance, and cost-effectiveness.

Performance and Structure

Performance: Superior Signal Integrity
With its carefully designed layer stack and use of high-quality materials, the Anylayer HDI 10Layers PCB guarantees exceptional signal integrity, reducing crosstalk and electromagnetic interference (EMI).

Structure: Multi-Layer Arrangement
The structure comprises multiple layers strategically arranged to separate power planes from signal layers, minimizing noise and enhancing overall circuit performance. The inclusion of HDI technology allows for more intricate designs within a compact form factor.

Features and Production Process

Special Features: Advanced Anylayer HDI Technology
Designed with anylayer HDI technology, this PCB offers unparalleled flexibility in internal layer connectivity, enhancing design complexity and functionality.

Production Process: Precision Manufacturing
Manufacturing begins with material selection and continues through precision drilling, plating, and laminating processes. Each step is meticulously controlled to ensure adherence to tight tolerances and high standards of quality.

Typical Use Cases and Scenarios

Typical Use Cases: Telecommunication Equipment
Commonly employed in telecommunication equipment such as routers, Schalter, and base stations where high-speed data transmission and reliability are essential.

Usage Scenarios: High-Frequency Applications
Suitable for high-frequency applications involving wireless communication modules, including those used in modern telecommunication devices.

In conclusion, the Anylayer HDI 10Layers PCB board stands out as a sophisticated solution for demanding communication product requirements, offering unparalleled density, performance, and reliability tailored to modern telecommunication needs.

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