Any Layer HDI PCB: The Most Complex Design Structure

Überblick

Any Layer HDI PCB is the most complex HDI PCB design structure, offering unparalleled connectivity and performance.

High-Density Interconnect Layers

All Layers as HDI

In this structure, all layers are high-density interconnect layers, allowing for free interconnection of conductors on any layer of the PCB.

Copper-Filled Stacked Microvia Structure

The copper-filled stacked microvia structure facilitates this interconnectivity, providing a reliable and efficient means of connecting various layers.

Anwendungen

Highly Complex Devices

This structure is ideal for highly complex, high pin-count devices such as CPU and GPU chips used in handheld and mobile devices.

Excellent Electrical Characteristics

The design yields excellent electrical characteristics, Damit es für Hochleistungsanwendungen geeignet ist.

Benefits

Reliable Interconnect Solution

The Any Layer HDI PCB structure provides a reliable interconnect solution for complex devices, ensuring stable and efficient performance.

UGPCB Advantage

This structure, featuring UGPCB technology, represents a significant advancement in PCB design and manufacturing.