Kommunikationsanschlussschaltplatine Design

Structure of the High-Frequency Hybrid Splint

Base Plate and Layers

The high-frequency hybrid splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from bottom to top in order. The second layer of the solder resist ink layer is also present.

Substrate Composition

The substrate includes a high-frequency area and an auxiliary area. The auxiliary area is fixed, und das Inlay im Hochfrequenzbereich sollte sich in einer festen Position befinden.

Utility Model of the High-Frequency Hybrid Splint

Division of the Splint

The utility model provides a high-frequency hybrid splint that is divided into two parts: ein Hochfrequenzbereich und ein Hilfsbereich. Es bietet mechanische Unterstützung.

Independent Arrangement of the High-Frequency Area

Das Versorgungsmodell zeigt, dass das Hochfrequenzbereich unabhängig voneinander arrangiert ist, und nur das Hochfrequenzbereich besteht aus Hochfrequenzmaterialien. This minimizes the use of high-frequency board materials and reduces production costs while satisfying high-frequency signals.