UGPCB-LOGO
Structure and Composition
Base Plate and Layer Configuration
The high-frequency hybrid splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from top to bottom in order from bottom to top. The second layer of solder resist ink layer is also present.
Substrate Division
The substrate includes a high-frequency area and an auxiliary area. The auxiliary area is finally fixed, und das Inlay im Hochfrequenzbereich sollte sich in einer festen Position befinden.
Design Features
Area Division and Material Usage
Das Versorgungsmodell bietet eine hochfrequente Hybridschiene, die in zwei Teile unterteilt ist: ein Hochfrequenzbereich und ein Hilfsbereich. The high-frequency area is independently arranged and only made of high-frequency materials. This minimizes the use of high-frequency board materials and reduces production cost while satisfying high-frequency signal requirements.
Mechanical Support
The splint provides mechanical support to the overall structure.
Product Specifications
High Frequency Hybrid Product Classification
- Schichten: 6
- Used Board: ro4350b + FR4
- Dicke: 1.6mm
- Größe: 210mm*280mm
- Oberflächenbehandlung: Gold-plated
- Minimum Aperture: 0.25mm
Application and Features
- Anwendung: Kommunikation
- Merkmale: High Frequency Mixed Pressure
