UGPCB-LOGO
Base Plate Structure and Positioning
The high-frequency hybrid splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from bottom to top in order.
Layer Composition and Auxiliary Area Fixation
The second layer of solder resist ink layer is also present. The substrate includes a high-frequency area and an auxiliary area. The auxiliary area is finally fixed, und das Inlay im Hochfrequenzbereich sollte sich in einer festen Position befinden.
High-Frequency Hybrid Splint Utility Model
Division into High-Frequency and Auxiliary Areas
Das Versorgungsmodell bietet eine hochfrequente Hybridschiene, die in zwei Teile unterteilt ist: ein Hochfrequenzbereich und ein Hilfsbereich. These areas provide mechanical support.
Independent Arrangement of High-Frequency Area
Das Versorgungsmodell zeigt, dass das Hochfrequenzbereich unabhängig voneinander arrangiert ist. Only the high-frequency area is made of high-frequency materials. This minimizes the use of high-frequency board materials and reduces production cost while satisfying high-frequency signals.
High Frequency Hybrid Product Specifications
Classification and Material
- Schichten: 6
- Used Board: RO4350B + FR4
- Dicke: 1.6mm
- Größe: 210mm*280mm
Surface Treatment and Aperture
- Oberflächenbehandlung: Gold-plated
- Minimum Aperture: 0.25mm
Application and Features
- Anwendung: Kommunikation
- Merkmale: High Frequency Mixed Pressure
By following these specifications and design principles, der UGPCB (formerly known as kingford) ensures optimal performance and cost-effectiveness in high-frequency applications.
