UGPCB-LOGO
Material
The Ro4350B Ceramic Hybrid High Frequency PCB is made from a mix of Rogers RO4350B and FR4 materials through pressing. This combination leverages the superior high-frequency performance of Rogers RO4350B ceramic substrate and the good processability of FR4, offering high performance at a cost-effective price.
Performance
This product features a four-layer structure with a dielectric constant (D K) of 3.48, a finished thickness of 1.2mm, a copper thickness of 1OZ, a dielectric thickness of 0.508mm, and a thermal conductivity of 0.69w/m.k. Zusätzlich, it boasts excellent flame retardancy, achieving the 94 V-0 rating, and is treated with immersion gold to enhance reliability and corrosion resistance.
Production Process
The production process of Ro4350B Ceramic Hybrid High Frequency PCB includes material preparation, mixing and pressing, cutting, drilling, plating, and surface treatment. Erste, Rogers RO4350B and FR4 materials are mixed in a certain proportion and evenly distributed. Dann, the mixed materials are pressed into sheets of the required thickness. Nächste, cutting and drilling processes are performed to shape the basic form of the circuit board. After that, plating is conducted to form conductive circuits and copper foil layers. Endlich, surface treatment, such as immersion gold, is applied to enhance reliability and corrosion resistance.
Anwendung
Due to its excellent high-frequency performance and good processability, Ro4350B Ceramic Hybrid High Frequency PCB is widely used in communication instrument PCBs. Zum Beispiel, it can be used to manufacture core components of communication equipment such as high-frequency signal amplifiers, filters, and antennas, meeting the high requirements for high-frequency performance and stability of modern communication devices.
