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About Smart phone main board PCB (HDI PCB) lead time:
12 layers 3-level HDI PCB,15-18 days for proofing, 15-25 days for batches, special multi-layer PCB proofing and special negotiation for batch delivery, UGPCB can make Smart phone main board PCB(HDI PCB) fast prototype fabrication and the fastest delivery time for 12-layer 3-level HD UGPCB is 7 Tage.
For the Smart phone main board PCB(HDI PCB) process capability of UGPCB, please click HDI PCB Technics Capacity.
UGPCB Circuits Limited(UGPCB®) is a high-tech enterprise focus on the R&D and production of precision PCB prototype. UGPCB independently developed the first PCB Automatic Quotation System(PAQS) in the industry, which automatically connected our PCB factory to realize intelligent service and PCB prototype rapid fabrication. Our ultimate goal is to build an Internet + Industrie 4.0 intelligent PCB factory cluster to provide professional PCB technology and PCB prototype fabrication services for customers.
UGPCB® manufactures microwave radio frequency(RF) Leiterplatte, hybrid high frequency PCB, (1-70Schichten) mehrschichtige Leiterplatte, HDI PCB, Starrflex-Leiterplatte, metal based PCB, Keramikplatine. We have deep research on PCB with special requirements such as blind buried hole PCB, Rückbohren der Leiterplatte, Stufenschlitzplatine, IC carrier PCB, ultra thick copper PCB, usw
