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Through Hole PCB Assembly Telecom Equipment PCB - Und

Leiterplattenbestückung/

Through Hole PCB Assembly Telecom Equipment PCB

Name: Through Hole PCB Assembly Telecom Equipment PCB

Substrat: FR4

Kupferdicke: 1/3OZ- 6OZ

Plattenstärke: 0.21-6.0mm

minute. Hole size: 0.20mm

minute. Line width: 4 Million

minute. Line spacing: 0.075 mm

Oberflächenbehandlung: spray tin/gold drill/OSP/lead-free spray tin

Board size: minimum 10*15mm, maximum 508*889mm

Product Type: OEM&ODM

PCB standard: IPC-A-610 D/IPC-III standard

  • Produktdetails

General Information

  • Model Number: PCB/PCB Assembly
  • Place of Origin: Guangdong, China
  • Supplier Type: OEM/ODM

Layer and Board Specifications

  • Schicht: 1-20
  • Board Thickness: 0.20mm-4.0mm
  • Kupferdicke: 17.5um-175um (0.5oz-5oz)

Solder Mask and Stencil Cleaning

  • Solder mask color: red, Schwarz, blue, Grün, yellow
  • Frequency of stencil cleaning: 1 time/5 to 10 pieces

Surface Treatment Options

  • Oberflächenbehandlung: HASL, Lead free HASL, OSP, Vergoldung, Immersion gold

Trace, Line, and Space Specifications

  • Min Trace Width: 0.15mm
  • Min. Line Spacing: 3 Mil (0.075 mm)
  • Min Space Width: 0.15mm

Base Material Options

  • Base Material: FR4/CEM-1/CEM-3/Aluminium

Drilling Specifications

  • Min Drilling Dia: 0.2mm

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