Microwave Circuit Design Advantages Using TP-1/2
Stable Dielectric Constant and Operating Temperature
The dielectric constant of TP-1/2 is stable and can be customized within the range of 3.0 Zu 22.0, depending on the specific requirements of the circuit design. The operating temperature ranges from -100 degrees Celsius to +150 Grad Celsius.
Reliable Peel Strength and Lower Manufacturing Costs
TP-1/2 offers a more reliable peel strength between copper and the substrate compared to vacuum film coating on ceramic substrates. This makes it easier for customers to process circuits with higher pass rates and significantly lower manufacturing costs than ceramic substrates.
Low Dissipation Factor and Mechanical Manufacturability
TP-1/2 has a dissipation factor (Tgside) of ≤1*10^-3, with minimal variation as frequency increases. It is also easily machinable through processes such as drilling, Stanzen, grinding, Schneiden, and etching, which are not possible with ceramic substrates.
Technical Specifications of TP-1/2
Aussehen
Smooth and neat on both sides: no stains, scratches, or dents.
Dimension and Tolerance
- Dimensions (A*B in mm): 120100, 150150, 160160, 180180, 200200, 170240
- Toleranz: -2
- Dicke und Toleranz: 0.8± 0,05, 1.0± 0,05, 1.2± 0,05, 1.5±0.06, 2.0±0.075, 3.0±0.10, 4.0±0.10, 5.0±0.12, 6.0±0.12, 10.0±0.2
- Customized Lamination: Available for special dimensions.
Mechanische Stärke
- Schalenstärke:
- Normaler Zustand: ≥6N/cm
- In alternating humidity and temperature: ≥4 N/cm
Chemical Property
The chemical etching method used for PCB can be applied without altering the dielectric properties of the materials.
Electrical Property
Name | Testbedingung | Einheit | Wert |
---|---|---|---|
Dichte | Normaler Zustand | g/cm³ | 1.0~2.9 |
Feuchtigkeitsabsorption | Dip in distilled water at 20±2°C for 24 Std. | % | ≤0.02 |
Betriebstemperatur | High-Low-Temperaturkammer | °C | -100~+150 |
Wärmeleitfähigkeit | -55~288°C | W/m/k | 0.6 |
CTE | Temperature rise of 96°C per hour | ppm/° C. | ≤6*10^-5 |
Schrumpfungsfaktor | 2 Stunden im kochenden Wasser | % | 0.0004 |
Oberflächenwiderstand | 500In DC, normal state | Mω | ≥1*10^7 |
Volumenwiderstand | Normaler Zustand | Mω · cm | ≥1*10^9 |
Stiftwiderstand | 500In DC, normal state | Mω | ≥1*10^6 |
Oberflächendielektriefestigkeit | Normaler Zustand | KV/mm | ≥1.5 |
Dielektrizitätskonstante | 10GHz | εr | 3,6,9.6,10.2,10.5,11,16,20,22(± 2%) (customizable) |
Dissipationsfaktor | 10GHz | Tgδ(εr 3-11) | ≤1*10^-3 |
Dissipationsfaktor | Tgδ(εr 12-22) | ≤1.5*10^-3 |