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Überblick
TU-872 LK and TU-87P LK are PCB materials with low Dk/Df and high thermal reliability. TU-872 LK is formulated using high-performance modified epoxy resin FR-4.
Material Composition and Properties
This PCB material is reinforced with ordinary woven E glass and designed to have a low dielectric constant and low loss factor, making it ideal for high-speed low-loss multilayer PCB and high-frequency multilayer PCB board applications. TU-872 LK PCB material is compatible with environmentally friendly lead-free processes and also with FR-4 processes. Außerdem, TU-872 LK multilayer PCB material demonstrates excellent CTE, superior chemical resistance, thermal stability, CAF resistance, and enhanced toughness due to compounds forming an allyl network.
Industry Approvals
TU-872 LK and TU-87P LK have received IPC-4101E Type Designations: /29, /99, /101, /126. They are IPC-4101E/126 Validation Services QPL Certified and have a UL designation of ANSI Grade: FR-4.0. The UL file number is E189572, with a Flammability rating of 94V-0 und eine maximale Betriebstemperatur von 130 ° C.
Standard Availability
TU-872 LK and TU-87P LK are available in thicknesses ranging from 0.002” [0.05mm] bis 0,062 ” [1.58mm], in sheet or panel form. Copper Foil Cladding ranges from 1/3 Zu 5 oz for built-up and double-sided boards. Prepregs are available in roll or panel form, with Glass Styles including 106, 1080, 3313, 2116, and other prepreg grades available upon request.
