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10-layer 3+N+3 HDI PCB - UGPCB

PCB HDI/

10-layer 3+N+3 HDI PCB

Nombre: 10-layer 3-stage HDI PCB

capas: 3+N+3

Hoja: FR4 Tg170

Espesor de la placa: 1.2milímetros

Panel size: 126*118mm/4

Espesor de cobre exterior: 35μm

Espesor de cobre de la capa interior: 18μm

Minimum through hole: 0.20milímetros

Minimum blind hole: 0.10milímetros

Minimum BGA: 0.25milímetros

Line width and spacing: 2.8/3.2mil

  • Detalles del producto

Technical Features and Applications of HDI PCBs

Impedance Specifications

  • 50 Ω Antenna
  • 90Oh & 100Ω Differential Impedance

Aplicaciones

Electrónica de Consumo

  • Cell Phones
  • Tablets
  • Ultrabooks
  • E-Readers
  • MP3 Players
  • GPS
  • Portable Game Consoles
  • DSCs (Digital Still Cameras)
  • Cameras
  • LCD TVs
  • POS Terminals

Interconexión de alta densidad (IDH) PCB Usage

Mobile and Portable Devices

HDI PCBs are widely used to reduce the weight and overall size of products, as well as improve the electrical performance of devices. High-density PCBs are often found in:

  • Mobile Phones
  • Touch Screen Devices
  • Laptops
  • Digital Cameras
  • 4G Network Communications

Other Applications

HDI PCB technology also plays an important role in:

  • Equipo médico
  • Electronic Aircraft Components

The Future of HDI PCB Technology

The possibilities for high-density interconnect PCB technology seem almost limitless.

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