6-layer high-frequency hybrid board

capas: 6 capas
Tablero usado: ro4350b + FR4
Espesor: 1.6milímetros
Tamaño: 210mm*280 mm
Tratamiento superficial: Chapado en oro
Apertura mínima: 0.25milímetros

Structure and Composition

The high-frequency hybrid pcb board splint includes a base plate, que está doblado y colocado en la primera capa de cable interno, la primera capa de alambre exterior, and the top surface of the solder mask ink layer from bottom to top in order from top to bottom. The positioning circuit layer, the second outer wire layer, the bottom surface of the substrate, and the second layer of solder resist ink layer are also part of its structure.

Division of Areas

El sustrato incluye un área de alta frecuencia y un área auxiliar. El área auxiliar finalmente se fija, and the high-frequency area inlay should be located in a fixed position.

Utility Model

El modelo de utilidad proporciona una férula híbrida de alta frecuencia, que se divide en dos partes: un área de alta frecuencia y un área auxiliar. It provides mechanical support.

Arreglo independiente del área de alta frecuencia

El modelo de utilidad revela que el área de alta frecuencia está organizada de forma independiente, and only the high-frequency area is made of high-frequency materials. Under the condition of satisfying high-frequency signals, the use of high-frequency board materials is minimized and the production cost is reduced.