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8 Layer RF PCB Rogers RO4350B + FR4 Hybrid Board - y

PCB híbrida/

8 Layer RF PCB Rogers RO4350B + FR4 Hybrid Board

Modelo: RO4350B Ceramic Hybrid High Frequency PCB

Material: Rogers RO4350B+FR4 Mixing Press

Capa: 8l

D K : 3.48

Espesor terminado : 2.5MM

Espesor de cobre : 1ONZ

Dielectric Thickness : 0.338milímetros

Conductividad térmica : 0.69w/m.k

Inflamabilidad : 94V-0

Tratamiento superficial: Oro de inmersión

Solicitud: Communication Instrument

  • Detalles del producto

RO4350B Ceramic Hybrid High Frequency PCB Overview

The RO4350B Ceramic Hybrid High Frequency PCB is a cutting-edge printed circuit board designed for high-performance applications in the communication industry. Combining the robustness of Rogers RO4350B material with the versatility of FR4, this PCB offers exceptional electrical and thermal properties, making it ideal for high-frequency circuits.

Composición de materiales

The RO4350B Ceramic Hybrid High Frequency PCB is crafted from a unique blend of Rogers RO4350B and FR4 materials, pressed together to create a robust and reliable substrate. This mix ensures a balance of electrical performance and cost-effectiveness, making it suitable for a wide range of applications.

Características de rendimiento

  • Layer Count: The PCB features an 8-layer design, providing ample space for complex circuitry and components.
  • Constante dieléctrica (D K): With a D K of 3.48, the board exhibits stable electrical performance across a wide frequency range.
  • Espesor terminado: The PCB has a finished thickness of 2.5mm, ensuring durability and structural integrity.
  • Espesor de cobre: The 1oz copper thickness offers excellent conductivity and current carrying capacity.
  • Dielectric Thickness: The dielectric layer is 0.338mm thick, contributing to the board’s overall electrical performance.
  • Conductividad térmica: With a thermal conductivity of 0.69w/m.k, the PCB effectively manages heat dissipation, preventing overheating and component failure.
  • Inflamabilidad: The board meets the 94V-0 flammability rating, ensuring safety in various environments.

Proceso de producción

The production of RO4350B Ceramic Hybrid High Frequency PCBs involves several precision steps:

  1. Material Preparation: Rogers RO4350B and FR4 materials are carefully selected and prepared for mixing.
  2. Mixing and Pressing: The materials are blended and pressed together under controlled conditions to form a uniform substrate.
  3. Circuit Design and Layout: The desired circuit patterns are designed and laid out using advanced CAD software.
  4. Manufacturing: The PCB is manufactured through a series of processes including etching, perforación, and copper plating.
  5. Tratamiento superficial: The board undergoes immersion gold surface treatment to enhance conductivity and corrosion resistance.
  6. Control de calidad: Each PCB undergoes rigorous testing to ensure it meets the specified performance standards.

Escenarios de aplicación

The RO4350B Ceramic Hybrid High Frequency PCB is ideal for use in communication instruments, incluido:

  • High-Frequency Circuits: The PCB’s exceptional electrical properties make it suitable for high-frequency circuits in radio and microwave systems.
  • Antenna Arrays: Its robust design and stable performance support the operation of complex antenna arrays in communication networks.
  • Signal Processing Units: The PCB’s ability to handle high-speed signals ensures reliable performance in signal processing units.

En resumen, the RO4350B Ceramic Hybrid High Frequency PCB is a versatile and high-performance solution for communication instruments, offering a combination of electrical excellence, thermal management, y durabilidad.

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