Communication high frequency hybrid PCB

Structure and Composition

Base Plate and Layers

The high-frequency hybrid PCB splint includes a base plate, que está doblado y colocado en la primera capa de cable interno, la primera capa de alambre exterior, y la superficie superior de la capa de tinta de la máscara de soldadura de abajo hacia arriba en orden. The positioning circuit layer, the second outer wire layer, and the bottom surface of the substrate are also part of this structure.

High-Frequency and Auxiliary Areas

El sustrato incluye un área de alta frecuencia y un área auxiliar. The auxiliary area is fixed, while the inlay in the high-frequency area should be located at a fixed position.

Design and Features

Division of Areas

El modelo de utilidad proporciona una férula híbrida de alta frecuencia, que se divide en dos partes: un área de alta frecuencia y un área auxiliar. This design provides mechanical support.

High-Frequency Materials

The high-frequency area is independently arranged, and only this area is made of high-frequency materials. This minimizes the use of high-frequency board materials while satisfying high-frequency signals, thereby reducing production costs.