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La férula híbrida de alta frecuencia incluye una placa base, que está doblado y colocado en la primera capa de cable interno, la primera capa de alambre exterior, y la superficie superior de la capa de tinta de la máscara de soldadura de abajo hacia arriba en orden. The positioning circuit layer, the second outer wire layer, and the bottom surface of the substrate follow. The substrate includes a second layer of solder resist ink. The substrate comprises a high-frequency area and an auxiliary area; the auxiliary area is fixed, and the high-frequency area inlay should be positioned accordingly.
El modelo de utilidad proporciona una férula híbrida de alta frecuencia, divided into two parts: un área de alta frecuencia y un área auxiliar, providing mechanical support. The high-frequency area is independently arranged and only made of high-frequency materials. This minimizes the use of high-frequency board materials and reduces production costs while satisfying high-frequency signal requirements.
High Frequency Hybrid Product Classification:
- capas: 6
- Tablero usado: RO4350B + FR4
- Espesor: 1.6milímetros
- Tamaño: 210mm x 280mm
- Tratamiento superficial: Chapado en oro
- Apertura mínima: 0.25milímetros
- Solicitud: Comunicación
- Características: Presión mixta de alta frecuencia
We provide Communication motherboard Turnkey PCB Assembly services. UGPCB is your one-stop Turnkey PCB Assembly company.
