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Diseño de placa de circuito de equipos de red. - y

Diseño de PCB de alta potencia/

Diseño de placa de circuito de equipos de red.

Nombre: Diseño de placa de circuito de equipos de red.

Capas diseñables: 1-32 capas

Ancho de línea mínimo y espacio entre líneas: 3mil

Apertura mínima del láser: 4mil

Apertura mecánica mínima: 8mil

Espesor de la lámina de cobre: 18-175centímetro (estándar: 18cm35cm70cm)

Fuerza de pelado: 1.25N/mm

Diámetro mínimo del agujero de perforación: un solo lado: 0.9mm/35mil

Diámetro mínimo del agujero: 0.25mm/10mil

Tolerancia de apertura: ≤φ0,8 mm ±0,05 mm

Tolerancia del agujero: ±0,05 mm

  • Detalles del producto

Various Names of Circuit Boards

The names of circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, tarjeta de circuitos, placa PCB, aluminum substrate, high frequency board, thick copper board, impedance board, tarjeta de circuito impreso, ultra-thin circuit board, Thin circuit boards, impreso (copper etching technology) circuit boards, etc..

Importance of Circuit Boards

The circuit board makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances.

Types of Circuit Boards

Printed Circuit Boards (PCB)

Circuit boards can be called printed circuit boards.

FPC Circuit Boards

FPC circuit boards (also known as flexible circuit boards) are a kind of high reliability made of polyimide or polyester film as the base material. They are an excellent flexible printed circuit board with the characteristics of high wiring density, peso ligero, espesor fino, and good bendability.

Soft-Rigid Board

The birth and development of the flexible and rigid combination board—FPC and PCB, gave birth to the combination of flexible and rigid board this new product. Por lo tanto, the soft-rigid board is a circuit board with FPC characteristics and PCB characteristics formed by combining flexible circuit boards and rigid circuit boards according to relevant process requirements through lamination and other processes.

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