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Composition of OSP
The general ingredients of OSP are: alkyl benzimidazole, organic acid, copper chloride, and deionized water.
Advantages of OSP
Thermal Stability
When compared with FLUXK, which is also a surface treatment agent, it is found that after the secondary heating of OSP at 235°C, the surface has no entanglement phenomenon, and the protective film is not damaged. Take two samples of OSP and FLUXK respectively, and put them into 6NC, 10% constant temperature surface submersible at the same time. After one week, the sample of OSP has no obvious change, while the surface of the sample of FLUXK has small dots, indicating that it is blocked and oxidized after heating.
Simple Management
The process of OSP is relatively simple and easy to operate. The client can use any kind of welding method to process it without special treatment. In circuit production, there is no need to consider the problem of surface uniformity. There is no need to worry about the concentration of its liquid medicine. The management method is simple and convenient, and the operation method is fool-proof.
Low Cost
Because OSP only reacts with the bare copper part to form a non-sticky, thin, and uniform protective film, the cost per square meter is lower than other surface treatment agents.
Reduced Pollution
OSP does not contain harmful substances that directly affect the environment, such as lead and lead compounds, bromine and bromine compounds, etc.. In the automatic production line, the working environment is good, and the equipment requirements are not high.
Easy Assembly for Downstream Manufacturers
Using OSP for surface treatment, the surface is flat. When printing tin or pasting SMD components, the offset of the parts is reduced, and the probability of empty welding of SMD solder joints is reduced.
Reducing Poor Solderability with OSP Circuit Boards
OSP circuit boards can reduce poor solderability. Durante el proceso de producción, inspectors are required to wear gloves to prevent hand sweat or water droplets from remaining on the solder joints, causing their components to decompose.
Suitability for Lead-Free Explosive Connections
In the environment where customers around the world use lead-free explosive connections, the general surface treatment is very suitable. As the OSP process does not contain harmful substances, the surface is smooth, the performance is stable, and the price is low. Using a simple surface treatment process will be the best trend in the circuit board industry. High-density BGA and CSP have also begun to be introduced and used.
