Rogers RO4350B + FR4 Mixed Dielectric RF PCB

Descripción general

The RO4350B + IT180 Mix Laminate High Frequency PCB is a specialized electronic component designed for high-performance applications in the communication industry. Combining the robustness of traditional FR4 materials with the advanced properties of Rogres RO4350B, this 4-layer PCB offers exceptional electrical performance and reliability.

Composición de materiales

The PCB is constructed using a unique blend of materials:

• Core Material: Rogres RO4350B, a high-frequency, low-loss laminate with a dielectric constant (DK) de 3.48. This material is known for its stability and low moisture absorption, making it ideal for high-speed digital and microwave applications.
• Support Layers: Two layers of FR4, a standard fiberglass-reinforced epoxy laminate, provide structural support and cost-effectiveness.

Layer Configuration

The PCB features a 4-layer configuration:

• Total Thickness: 1.0milímetros
• Dielectric Thickness: 0.508mm for the RO4350B layers
• Espesor de cobre: 1/0.5/0.5/1 ounce per square foot (ONZ), ensuring optimal conductivity and current carrying capacity.

Características de rendimiento

The RO4350B + IT180 Mix Laminate High Frequency PCB offers several key performance benefits:

• Low Loss: The RO4350B material minimizes signal loss, ensuring clear and accurate transmission over high frequencies.
• Stable Dielectric Constant: The consistent DK of 3.48 across temperature and humidity changes maintains signal integrity.
• High Reliability: The combination of RO4350B and FR4 provides a durable and reliable PCB suitable for demanding applications.

Proceso de producción

The production of the RO4350B + IT180 Mix Laminate High Frequency PCB involves several precision steps:

1. Material Preparation: RO4350B and FR4 materials are cut to size and prepared for lamination.
2. Lamination: The layers are bonded together under controlled conditions to ensure uniform thickness and adhesion.
3. Copper Cladding: Copper foil is applied to the outer layers to form the conductive circuits.
4. Etching: Unwanted copper is removed to create the desired circuit patterns.
5. Plating: An immersion gold finish is applied to the copper surfaces for enhanced conductivity and corrosion resistance.
6. Final Assembly: Components are mounted, and the PCB is tested to ensure it meets specifications.

Escenarios de aplicación

The RO4350B + IT180 Mix Laminate High Frequency PCB is ideal for a range of communication applications, incluido:

• Wireless Communication Systems: Base stations, antenas, and other components requiring high-frequency signal transmission.
• Radar Systems: High-precision radar equipment that relies on low-loss materials for accurate signal detection and processing.
• Satellite Communications: Equipment that operates in extreme environments and requires reliable, high-speed data transmission.

Conclusión

The RO4350B + IT180 Mix Laminate High Frequency PCB is a versatile and high-performance component suitable for demanding communication applications. Its combination of advanced materials and precision manufacturing ensures reliable performance and long-term durability.