UGPCB LOGO
F4B-1/2 Teflon PCB Glass Fabric Copper-Clad Laminates
F4B-1/2 Teflon PCB glass fabric copper-clad laminates are designed to meet the stringent electrical performance requirements of microwave circuits. These laminates stand out due to their excellent electrical properties and enhanced mechanical strength, making them ideal for microwave PCB applications.
Especificaciones técnicas
Apariencia
The appearance of these laminates meets the specification requirements set by National and Military Standards for microwave PCB laminates.
Tipos
- F4B255
- F4B265
Constante dieléctrica
- 2.55
- 2.65
Available Dimensions (milímetros)
- 300×250, 380×350, 440×550, 500×500, 460×610, 600×500
- 840×840, 1200×1000, 1500×1000
- Custom dimensions are available upon request.
Espesor de cobre
- 0.035μm, 0.018μm
Espesor y tolerancia (milímetros)
| Espesor del laminado | Tolerancia |
|---|---|
| 0.17, 0.25 | ±0,025 |
| 0.5, 0.8, 1.0 | ±0,05 |
| 1.5, 2.0 | ±0,05 |
| 3.0, 4.0, 5.0 | ±0,09 |
El espesor del laminado incluye el espesor del cobre.. Custom dimensions are available upon request.
Resistencia mecánica
| Espesor (milímetros) | Deformación máxima | Single Side | Double Side |
|---|---|---|---|
| 0.25~0.5 | 0.030 | 0.050 | 0.025 |
| 0.8~1.0 | 0.025 | 0.030 | 0.020 |
| 1.5~2.0 | 0.020 | 0.025 | 0.015 |
| 3.0~5.0 | 0.015 | 0.020 | 0.010 |
Fuerza de corte/punzonado:
- Thickness ≤1mm: No burrs after cutting, minimum space between punching holes is 0.55mm, no delamination.
- Espesor >1milímetros: No burrs after cutting, minimum space between punching holes is 1.10mm, no delamination.
Fuerza de pelado (1onzas de cobre)
- Normal State: ≥15N/cm; Sin burbujas ni delaminación.
- After Exposure to Constant Humidity and Temperature: Peel strength ≥12N/cm (after keeping in melting solder at 260°C ±2°C for 20 artículos de segunda clase).
Chemical Properties
These laminates can be chemically etched using standard PCB methods without changing their dielectric properties. Plating through holes is possible but requires sodium treatment or plasma treatment.
Electrical Properties
| Nombre | Condición de prueba | Unidad | Valor |
|---|---|---|---|
| Densidad | estado normal | gramos/cm³ | 2.2~2.3 |
| Absorción de humedad | Sumergir en agua destilada a 20±2°C durante 24 horas | % | ≤0,1 |
| Temperatura de funcionamiento | Cámara de alta y baja temperatura | °C | -50～+260 |
| Conductividad térmica | W/m/k | 0.3 | |
| CTE (típico) | 0～100°C | ppm/°C | incógnita:16, y:21 z:186 |
| Factor de contracción | 2 horas en agua hirviendo | % | ≤0,0002 |
| Resistividad superficial | 500V DC, estado normal | MES | ≥1*10⁴ |
| Humedad y temperatura constantes. | ≥5*10³ | ||
| Resistividad de volumen | estado normal | MΩ.cm | ≥1*10⁶ |
| Humedad y temperatura constantes. | ≥9*10⁴ | ||
| Pin Resistance | 500VCC, estado normal | MΩ | ≥5*10⁴ |
| Humedad y temperatura constantes. | ≥5*102 | ||
| Rigidez dieléctrica superficial | estado normal, diámetro = 1 mm (kv/mm) | ≥1,2 | |
| Humedad y temperatura constantes. | ≥1,1 | ||
| Constante dieléctrica | 10GHZ, | εr | 2.55/2.65 (±2%) |
| Factor de disipación | 10GHZ, | tgδ | ≤1*10⁻³ |
