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F4BME-2-A Teflon PCB Glass Fabric Copper-Clad Laminates
F4BME-2-A Teflon PCB glass fabric copper-clad laminates are manufactured using imported woven glass fabric, Teflon PCB resin, and filler with a Nano-ceramic membrane. This product adheres to scientific formulations and stringent technological processes, utilizing low roughness copper foil. It surpasses the F4BM series in electrical performance and surface insulation resistance stability, boasting a higher intermodulation index than F4BME-1/2.
Especificaciones técnicas
Apariencia: Meets the specification requirements for microwave PCB laminates according to National and Military Standards.
Tipos:
- F4BME-2-A255
- F4BME-2-A262
- F4BME-2-A275
- F4BME-2-A285
- F4BME-2-A294
- F4BME-2-A300
Dimensiones (milímetros):
- 550*440
- 500*500
- 600*500
- 650*500
- 1000*850
- 1100*1000
- 1220*1000
- 1500*1000
Custom dimensions are available upon request.
Espesor y tolerancia (milímetros):
| Espesor del laminado | Tolerancia |
|---|---|
| 0.254 | ±0,025 |
| 0.508 | ±0,05 |
| 0.762 | ±0,05 |
| 0.787 | ±0,05 |
| 1.016 | ±0,05 |
| 1.27 | ±0,05 |
| 1.524 | ±0,05 |
| 2.0 | ±0,075 |
| 3.0 | ±0,09 |
| 4.0 | ±0.1 |
| 5.0 | ±0.1 |
| 6.0 | ±0.12 |
| 9.0 | ±0.18 |
| 10.0 | ±0.18 |
| 12.0 | ±0.2 |
Resistencia mecánica:
- Cutting/Punching:
- Espesor <1milímetros: No burrs after cutting; minimum space between two punching holes is 0.55mm, no delamination.
- Espesor >1milímetros: No burrs after cutting; minimum space between two punching holes is 1.10mm, no delamination.
- Fuerza de pelado (1onzas de cobre):
- estado normal: ≥14N/cm; No bubble or delamination peel strength: ≥12N/cm (under constant humidity and temperature, kept in melting solder at 265°C ±2°C for 20 artículos de segunda clase).
Propiedad química: The chemical etching method for PCB can be used without altering the dielectric properties of the laminate. Plating through holes requires sodium treatment or plasma treatment.
Propiedad eléctrica:
| Nombre | Condición de prueba | Unidad | Valor |
|---|---|---|---|
| Densidad | estado normal | gramos/cm³ | 2.1～2.35 |
| Absorción de humedad | Dip in distilled water at 20±2°C for 24 horas | % | ≤0.07 |
| Temperatura de funcionamiento | Cámara de alta y baja temperatura | °C | -50°C～+260°C |
| Conductividad térmica | W/m/k | 0.45~0.55 | |
| CTE (típico) | -55～288°C (εr :2.5~2.9) | ppm/°C | X: 16, Y: 20, Z: 170 |
| CTE (típico) | -55～288°C (εr :2.9~3.0) | ppm/°C | X: 12 Y: 15 Z: 90 |
| Factor de contracción | 2 horas en agua hirviendo | % | <0.0002 |
| Resistividad superficial | corriente continua, 500V, estado normal | MΩ | ≥4*10^5 |
| Resistividad de volumen | estado normal | MΩ·cm | ≥6*10^6 |
| Surface dielectric strength | diámetro = 1 mm(kv/mm) | ≥1,2 | |
| Constante dieléctrica | 10GHz | See table below | |
| Factor de disipación | 10GHz | See table below | |
| PIMD (2.5GHz) | db | -160 |
UL Flammability Rating: 94 V-0
For more information or to place an order, please visit our website www.ugpcb.com or contact us via email at sales@ipcb.com.
UGPCB Products:
UGPCB offers a wide range of products including:
- Radio/Microwave/Hybrid High Frequency FR4 Double/Multi-Layer 1~3+N+3 HDI, Anylayer HDI, Rigid-Flex, Blind Buried Slotted, Backdrilled IC Heavy Copper Board, y más.
If you have any questions or need further assistance, please do not hesitate to contact us through our website or send an inquiry directly to sales@ugpcb.com.
