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F4BMX-1/2 Teflon PCB Overview
F4BMX-1/2 is a high-performance laminate crafted by layering imported varnished glass cloth with Teflon resin and Polytrtrafluoroethylene film. This product adheres to scientific formulations and stringent technological processes, offering superior electrical performance compared to the F4B series. It features a broader range of dielectric constants, lower dielectric loss tangent, increased resistance, and more stable performance. The use of imported woven glass fabric ensures consistency in the properties of the laminate.
F4BMX-1/2 Technical Specifications
Apariencia
Meets the specification requirements for microwave PCB laminates according to national and military standards.
Tipos
- F4BMX217
- F4BMX220
- F4BMX245
- F4BMX255
- F4BMX265
- F4BMX275
- F4BMX285
- F4BMX294
- F4BMX300
Constante dieléctrica
- F4BMX217: 2.17
- F4BMX220: 2.20
- F4BMX245: 2.45
- F4BMX255: 2.55
- F4BMX265: 2.65
- F4BMX275: 2.75
- F4BMX285: 2.85
- F4BMX294: 2.94
- F4BMX300: 3.0
Dimensiones (milímetros)
- Standard dimensions available: 300250, 380350, 440550, 500500, 460610, 600500, 840840, 8401200, 15001000, 18001000
- Customized dimensions are also available.
Espesor y tolerancia (milímetros)
| Espesor del laminado | Tolerancia |
|---|---|
| 0.25 | ±0,025 |
| 0.5 | ±0,05 |
| 0.8 | ±0,05 |
| 1.0 | ±0,05 |
| 1.5 | ±0,075 |
| 2.0 | ±0,09 |
| 3.0 | ±0.1 |
| 4.0 | ±0.1 |
| 5.0 | ±0.1 |
| 6.0 | ±0.12 |
| 8.0 | ±0.15 |
| 10.0 | ±0.18 |
| 12.0 | ±0.2 |
Nota: El espesor del laminado incluye el espesor del cobre.. Customized laminates are available for special dimensions.
Resistencia mecánica
| Espesor(milímetros) | Deformación máxima | Original Board | Single Side | Double Side |
|---|---|---|---|---|
| 0.25~0.5 | 0.030 | 0.050 | 0.025 | 0.020 |
| 0.8~1.0 | 0.025 | 0.030 | 0.020 | 0.020 |
| 1.5~2.0 | 0.020 | 0.025 | 0.015 | 0.015 |
| 3.0~5.0 | 0.015 | 0.020 | 0.010 | 0.010 |
Fuerza de corte/punzonado:
- For thickness <1milímetros, no burrs after cutting; minimum space between two punching holes is 0.55mm, no delamination.
- For thickness >1milímetros, no burrs after cutting; minimum space between two punching holes is 1.10mm, no delamination.
Fuerza de pelado (for 1oz copper):
- estado normal: ≥18N/cm; No bubble or delamination peel strength: ≥15N/cm (en humedad y temperatura constantes, and kept in molten solder at 260 degree Celsius±2 degree Celsius for 20 artículos de segunda clase).
Propiedad química
The chemical etching method for PCB can be used without altering the dielectric properties of the laminate. Plating through holes requires sodium treatment or plasma treatment. Hot Air Level temperature must not exceed 253 degrees Celsius and cannot be repeated.
Propiedad eléctrica
| Nombre | Condición de prueba | Unidad | Valor |
|---|---|---|---|
| Densidad | estado normal | gramos/cm³ | 2.1～2.35 |
| Absorción de humedad | Dip in distilled water at 20±2°C for 24 horas | % | ≤0.08 |
| Temperatura de funcionamiento | Cámara de alta y baja temperatura | degree Celsius | -50°C～+260°C |
| Conductividad térmica | W/m/k | 0.3~0.5 | |
| CTE | Typical (εr :2.1~2.3) | ppm/°C | X: 24(incógnita), Y: 34(y), Z: 235(z) |
| CTE | Typical (εr :2.3~2.9) | ppm/°C | X: 16(incógnita), Y: 20(y), Z: 168(z) |
| CTE | Typical (εr :2.9~3.38) | ppm/°C | X: 12(incógnita), Y: 15(y), Z: 92(z) |
| Factor de contracción | 2 horas en agua hirviendo | % | < 0.0002 |
| Resistividad superficial | corriente continua, 500V, estado normal | MΩ | ≥2*10^5 |
| Under constant humidity and temperature | ≥8*10^4 | ||
| Resistividad de volumen | estado normal | MΩ·cm | ≥8*10^6 |
| Under constant humidity and temperature | ≥2*10^5 | ||
| Surface dielectric strength | estado normal | diámetro = 1 mm(kv/mm) | ≥1,2 |
| Under constant humidity and temperature | ≥1,1 | ||
| Constante dieléctrica | 10GHz, εr | (±2%) | See table below |
| Factor de disipación | 10GHz tgδ | See table below |
Dielectric Constant and Dissipation Factor at 10GHz
| Tipo | Constante dieléctrica (εr) | Factor de disipación (tgδ) |
|---|---|---|
| F4BMX217 | 2.17 | – |
| F4BMX220 | 2.20 | – |
| F4BMX245 | 2.45 | – |
| F4BMX255 | 2.55 | – |
| F4BMX265 | 2.65 | – |
| F4BMX275 | 2.75 | – |
| F4BMX285 | 2.85 | – |
| F4BMX294 | 2.94 | – |
| F4BMX300 | 3.0 | – |
UGPCB Products and Services
UGPCB offers a variety of products including Radio/Microwave/High Frequency hybrid circuits, single layer to multilayer AnyLayerHDI, BGA, IC Heavy Copper Board, and custom solutions such as Rigid-Flex, IDH, Blind Buried Slotted Blind Back Drilled, and IC Carrier boards. Our services include PCB manufacturing, galvanoplastia, y más. For any inquiries, please contact us through our website www.ugpcb.com or email us at sales@ugpcb.com.
