Microwave Circuit Design Advantages Using TP-1/2
Stable Dielectric Constant and Operating Temperature
The dielectric constant of TP-1/2 is stable and can be customized within the range of 3.0 a 22.0, depending on the specific requirements of the circuit design. The operating temperature ranges from -100 degrees Celsius to +150 degrees Celsius.
Reliable Peel Strength and Lower Manufacturing Costs
TP-1/2 offers a more reliable peel strength between copper and the substrate compared to vacuum film coating on ceramic substrates. This makes it easier for customers to process circuits with higher pass rates and significantly lower manufacturing costs than ceramic substrates.
Low Dissipation Factor and Mechanical Manufacturability
TP-1/2 has a dissipation factor (tgδ) of ≤1*10^-3, with minimal variation as frequency increases. It is also easily machinable through processes such as drilling, puñetazos, grinding, corte, and etching, which are not possible with ceramic substrates.
Technical Specifications of TP-1/2
Apariencia
Smooth and neat on both sides: no stains, scratches, or dents.
Dimension and Tolerance
- Dimensiones (A*B in mm): 120100, 150150, 160160, 180180, 200200, 170240
- Tolerancia: -2
- Espesor y tolerancia: 0.8±0,05, 1.0±0,05, 1.2±0,05, 1.5±0.06, 2.0±0,075, 3.0±0,10, 4.0±0,10, 5.0±0.12, 6.0±0.12, 10.0±0.2
- Customized Lamination: Available for special dimensions.
Resistencia mecánica
- Fuerza de pelado:
- estado normal: ≥6N/cm
- In alternating humidity and temperature: ≥4 N/cm
Propiedad química
The chemical etching method used for PCB can be applied without altering the dielectric properties of the materials.
Propiedad eléctrica
Nombre | Condición de prueba | Unidad | Valor |
---|---|---|---|
Densidad | estado normal | gramos/cm³ | 1.0~2.9 |
Absorción de humedad | Dip in distilled water at 20±2°C for 24 horas | % | ≤0.02 |
Temperatura de funcionamiento | Cámara de alta y baja temperatura | °C | -100~+150 |
Conductividad térmica | -55~288°C | W/m/k | 0.6 |
CTE | Temperature rise of 96°C per hour | ppm/°C | ≤6*10^-5 |
Factor de contracción | 2 horas en agua hirviendo | % | 0.0004 |
Resistividad superficial | 500V DC, normal state | MΩ | ≥1*10^7 |
Resistividad de volumen | estado normal | MΩ·cm | ≥1*10^9 |
Pin Resistance | 500V DC, normal state | MΩ | ≥1*10^6 |
Rigidez dieléctrica superficial | estado normal | kv/mm | ≥1.5 |
Constante dieléctrica | 10GHZ | εr | 3,6,9.6,10.2,10.5,11,16,20,22(±2%) (customizable) |
Factor de disipación | 10GHZ | Tgδ(εr 3-11) | ≤1*10^-3 |
Factor de disipación | Tgδ(εr 12-22) | ≤1,5*10^-3 |