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Teflon Woven Glass Fabric Copper-Clad Laminates
Teflon woven glass fabric copper-clad laminates are formulated with varnished glass cloth, prepreg, and Teflon PCB resin through scientific formulation and strict technology procedures. These materials offer several advantages over the F4B series in terms of electrical performance, including a wider range of dielectric constants, low dielectric loss angle tangent, increased resistance, and more stable performance.
Especificaciones técnicas
Apariencia
The appearance meets the specification requirements for microwave PCB baseplates specified in National and Military Standards.
Tipos
- F4BM220
- F4BM255
- F4BM265
- F4BM300
- F4BM350
Permittivity
- 2.20
- 2.55
- 2.65
- 3.0
- 3.50
Dimensiones (milímetros)
- 300*250
- 350*380
- 440*550
- 500*500
- 460*610
- 600*500
- 840*840
- 840*1200
- 1500*1000
Para dimensiones especiales, customized lamination is available.
Espesor y tolerancia (milímetros)
| Plate Thickness | Tolerancia |
|---|---|
| 0.25 | ±0.02～±0.04 |
| 0.5 | |
| 0.8 | |
| 1.0 | |
| 1.5 | ±0.05～±0.07 |
| 2.0 | |
| 3.0 | |
| 4.0 | |
| 5.0 |
Plate thickness includes the copper thickness. Para dimensiones especiales, customized lamination is available.
Mechanical Properties
Angularity
| Plate Thickness(milímetros) | Maximum Angularity mm/mm |
|---|---|
| tablero original | Single-sided board |
| 0.25~0.5 | 0.03 |
| 0.8~1.0 | 0.025 |
| 1.5~2.0 | 0.020 |
| 3.0~5.0 | 0.015 |
Cutting/ Punching Property
- For plates <1milímetros, no burrs after cutting, minimum space between two punching holes is 0.55mm, no separation.
- For plates ≥1mm, no burrs after cutting, minimum space between two punching holes is 1.10mm, no separation.
Fuerza de pelado
- In normal state: ≥18N/cm; no bubbling, no separation, and peel strength ≥15 N/cm when in the environment of constant humidity and temperature and kept in the melting solder of 260 degree Celsius±2 degree Celsius for 20 artículos de segunda clase.
Chemical Properties
According to different properties of baseplates, the chemical etching method for PCB can be used for the circuit processing, the dielectric properties of materials are not changed and the holes can be metallized.
Electrical Properties
| Names | Test Conditions | Unidad | Presupuesto |
|---|---|---|---|
| Gravity | estado normal | g/cm3 | 2.2~2.3 |
| Water absorption rate | Dip in distilled water of 20±2 degree Celsius for 24 horas | % | ≤0.02 |
| Operating temperature | Cámara de alta y baja temperatura | degree Celsius | -50～+260 |
| Thermal conductivity coefficient | Kcal /m .h. degree Celsius | 0.8 | |
| Coefficient of thermal expansion | Temperature rise of 96 degree Celsius per hour | Coefficient of thermal expansion*1 | ≤5*10^-5 |
| Shrinkage factor | Two hours in boiling water | % | 0.0002 |
| Surface insulation resistance | 500V DC | estado normal | MΩ |
| Humedad y temperatura constantes. | ≥1*10^3 | ||
| Volume resistance | estado normal | MΩ.cm | ≥1*10^6 |
| Humedad y temperatura constantes. | ≥1*10^5 | ||
| Pin resistance | 500V DC | estado normal | MΩ |
| Humedad y temperatura constantes. | ≥1*10^3 | ||
| Surface dielectric strength | estado normal | δ=1mm(kV/mm) | ≥1,2 |
| Humedad y temperatura constantes. | ≥1,1 | ||
| Permittivity | 10GHZ | er | 2.20 |
| 2.55 | |||
| 2.65(±2%) | |||
| 3.0 | |||
| 3.5 | |||
| Dielectric loss angle tangent | 10GHZ | tgδ | ≤7*10^-4 |
UGPCB has produced Teflon woven glass fabric copper-clad laminates products steadily. If you need them, por favor póngase en contacto con UGPCB.
