TU-768 Digital de alta velocidad (HSD) Materiales de PCB

High-Tg and High Thermal Reliability Laminate and Prepreg

Core: TU-768; Prepreg: TU-768P

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) proceso. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

Main Applications

• Electrónica de Consumo
• Server, workstation
• Automotor

Características clave

• Lead Free process compatible
• Excellent coefficient of thermal expansion
• Anti-CAF property
• Superior chemical and thermal resistance
• Fluorescence for AOI
• Moisture resistance

Property

Industry Approvals

• IPC-4101E Type Designation: /98, /99, /101, /126
• IPC-4101E/126 Validation Services QPL Certified
• UL Designation – ANSI Grade: FR-4.0
• UL File Number: E189572
• Flammability Rating: 94V-0
• Maximum Operating Temperature: 130°C

Standard Availability

• Espesor: 0.002"[0.05milímetros] to 0.062”[1.58milímetros], available in sheet or panel form
• Copper Foil Cladding: 1/8 to 12oz (HTE) for built-up; 1/8 to 3oz (HTE) for double sides and H to 2oz (MLS)
• Prepregs: Available in roll or panel form
• Glass Styles: 106, 1080, 2113, 2116, 1506 y 7628 etc..