Materiales de PCB TUC TU-872 SLK y TU-87P SLK

Descripción general

TUC TU-872 SLK and TU-87P SLK are PCB materials with low Dk/Df and high thermal reliability. TU-872 SLK serves as the Core, while TU-87P SLK functions as the Prepreg (PP).

Composition and Properties

TU-872 SLK is crafted from high-performance modified epoxy resin FR-4. Reinforced with ordinary woven E glass, this PCB material is designed to exhibit a low dielectric constant and low loss factor, making it ideal for high-speed low-loss PCB and high-frequency multilayer PCB applications. It is compatible with environmentally friendly lead-free processes and FR-4 processes. TU-872 SLK multilayer PCB also demonstrates excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, CAF resistance, and enhanced toughness due to compounds that form an allyl network.

Industry Approvals

TUC TU-872 SLK and TU-87P SLK have received industry approvals, including PC-4101E Type Designations /29, /99, /101, /126. They are IPC-4101E/126 Validation Services QPL Certified, with a UL Designation – ANSI Grade of FR-4.0. The UL File Number is E189572, and the Flammability Rating is 94V-0. The Maximum Operating Temperature is 130°C.

Standard Availability

TUC TU-872 SLK and TU-87P SLK are available in thicknesses ranging from 0.002” [0.05milímetros] to 0.062” [1.58milímetros], in sheet or panel form. Copper Foil Cladding ranges from 1/3 a 5 oz for built-up and double-sided boards. Prepregs are available in roll or panel form, with Glass Styles including 106, 1080, 3313, 2116, and other prepreg grades available upon request.