UGPCB LOGO
La máquina de perforación láser Mitsubishi PCB es un equipo central en la fabricación de la placa de circuito de alta gama y uno de los sistemas clave de producción de PCB introducidos por UGPCB a través de una inversión significativa. Designed for processing micro-vias in precision PCBs such as High-Density Interconnect (IDH) boards y sustratos CI, it utilizes UV/CO₂ laser technology to accurately ablate PCB materials, creating blind vias and through-holes as small as 30μm in diameter. This capability addresses the growing demand for miniaturization and high-precision interconnects in 5G communications, electrónica de consumo, and related fields. Además, it enables rapid prototyping and small-batch production of advanced PCBs.
Core Function
The machine’s primary role is to achieve micron-level precision in via formation, ensuring reliable electrical connections in multilayer boards while maintaining structural integrity.
Características clave
Ultra-High Precision
Equipped with optical positioning and dynamic focusing technologies, the machine achieves a drilling positional accuracy of ±10μm. It adapts to complex laminated materials (p.ej., cobre, resina) and heterogeneous layer structures.
Alta eficiencia
By employing multi-beam parallel processing, it delivers a drilling speed exceeding 200,000 holes per hour, significantly boosting production capacity for high-volume orders.
Intelligent Control
An integrated real-time monitoring system automatically optimizes laser energy output, minimizing issues such as overburning or residual glue, thereby ensuring consistently high yields.
Robust Durability
Built-in temperature control and dust removal modules enable 24/7 continuous operation with minimal downtime. The design emphasizes ease of maintenance and long-term reliability.
Energy Efficiency
With optimized laser utilization, the system reduces energy consumption by 30% compared to traditional mechanical drilling methods, aligning with global green manufacturing standards.
Impact and Significance
Combining alta velocidad, precision, and low material loss, the Mitsubishi PCB Laser Drilling Machine has become indispensable for mass production of advanced PCBs. It drives the evolution of electronic components toward smaller form factors, higher density, and enhanced reliability, cementing its role as a cornerstone of next-generation electronics manufacturing.
