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10-couche 3+N+3 PCB HDI - et

PCB HDI/

10-couche 3+N+3 PCB HDI

Nom: 10-layer 3-stage HDI PCB

Calques: 3+N+3

Feuille: FR4 Tg170

Épaisseur de la plaque: 1.2mm

Panel size: 126*118mm/4

Épaisseur extérieure du cuivre: 35µm

Inner layer copper thickness: 18µm

Minimum through hole: 0.20mm

Minimum blind hole: 0.10mm

Minimum BGA: 0.25mm

Line width and spacing: 2.8/3.2mil

  • Détails du produit

Technical Features and Applications of HDI PCBs

Impedance Specifications

  • 50 Ω Antenna
  • 90Ω & 100Ω Differential Impedance

Applications

Electronique grand public

  • Cell Phones
  • Tablets
  • Ultrabooks
  • E-Readers
  • MP3 Players
  • GPS
  • Portable Game Consoles
  • DSCs (Digital Still Cameras)
  • Cameras
  • LCD TVs
  • POS Terminals

High-Density Interconnect (IDH) PCB Usage

Mobile and Portable Devices

HDI PCBs are widely used to reduce the weight and overall size of products, as well as improve the electrical performance of devices. High-density PCBs are often found in:

  • Mobile Phones
  • Touch Screen Devices
  • Laptops
  • Digital Cameras
  • 4G Network Communications

Other Applications

HDI PCB technology also plays an important role in:

  • Équipement médical
  • Electronic Aircraft Components

The Future of HDI PCB Technology

The possibilities for high-density interconnect PCB technology seem almost limitless.

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