LOGO UGPCB
Size and Space Savings
- Small size provides significant space savings.
Modularity and Flexibility
- Modular design provides application flexibility.
High Performance
- High performance system.
High-Density Backplane System
- High-density backplane system – jusqu'à 84 differential pairs per linear inch.
Post Spacing
- 1.80 mm post spacing.
Design Configurations
- 3 Pair, 4 Pair, et 6 Pair Designs.
- 4, 6, ou 8 columns.
- 12 – 48 pairs.
Signal/Ground Pin Options
- Multiple signal/ground pin classification options.
Integrated Components
- Provides integrated power, boot, keying, and sidewalls.
Impedance Options
- 85 Ω and 100 Ω options.
Hot Swap Capability
- Three-level sorting supports hot swap.
Rentabilité
- Cost-effective design for low-speed applications.
