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16-layer 2+N+2 high-precision PCB design - et

Conception de circuits imprimés HDI/

16-layer 2+N+2 high-precision PCB design

Nom: 16-layer two-stage high-precision PCB design

Plaque: TG170/TG180, F4BM, FR4, FR1-4, etc..

Couches concevables: 1-32 couches

Largeur de ligne minimale et espacement des lignes: 3mil

Ouverture laser minimale: 4mil

Ouverture mécanique minimale: 8mil

Épaisseur de la feuille de cuivre: 18-175cm (standard: 18cm35cm70cm)

Résistance au pelage: 1.25N/mm

Diamètre minimum du trou de perforation: un seul côté: 0.9mm/35 mil

Diamètre minimum du trou: 0.25mm/10 mil

Tolérance d'ouverture: ≤φ0,8 mm ± 0,05 mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

  • Détails du produit

Overview of 16-Layer Stack PCB

A 16-layer stack has 16 layers of routing and is typically used for high-density designs.

Routing Challenges and Solutions

Routing Challenges

In EDA applications, routing techniques often fail to route the design.

Solution: Adding Multiple Layers

That’s why manufacturers add multiple layers to accommodate the complexity of high-density designs.

Specifications of 16-Layer PCB Fabrication

Composition

  • Made of 16 couches
  • Made of halogen-free materials, aluminium, CEM, and FR

Plate Thickness

  • Extended to 7 mm

Taille du conseil

  • Maximum finished board size is 500 x 500 mm

Finishes

  • Halogen-free gold and silver plated

UGPCB: High-Quality Fabrication

UGPCB offers high-quality fabrication of 16-layer stack PCBs, ensuring reliability and performance for high-density designs.

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