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Introduction to the 8L 1+N+1 HDI PCB Product
The 8L 1+N+1 HDI PCB product is a high-density interconnect printed circuit board designed for advanced electronic applications. It features a complex structure with multiple layers and specialized processes to meet the demands of modern micro electronic products.
Definition and Design Requirements
The 8L 1+N+1 HDI PCB stands for a printed circuit board with eight layers on each side, one power layer, N signal layers, and one additional signal layer. The design requirements include high density, precise trace and space measurements, and specific hole sizes for mechanical and laser drilling.
Working Principle
The HDI PCB works by providing intricate electrical connections between various components on the board. The high-density layout allows for more components to be packed into a smaller space, improving overall functionality and performance.
Applications
These PCBs are primarily used in micro electronic products where compact size, haute performance, and reliability are crucial. They are ideal for applications such as wearable technology, smart sensors, and other miniaturized electronic devices.
Classification
HDI PCBs can be classified based on their layer count, material, and special processes. The 8L 1+N+1 configuration indicates a specific type of multilayer PCB with enhanced capabilities.
Matériel
The primary material used for this PCB is FR-4, which is a flame-resistant glass-epoxy laminate. This material provides excellent thermal stability, mechanical strength, and electrical insulation properties.
Performance
The 8L 1+N+1 HDI PCB offers superior electrical performance, including low signal loss and high-speed data transmission. Its immersion gold and OSP surface treatments ensure long-lasting durability and reliable connections.
Structure
The structure of this PCB includes eight layers on each side, with internal and external copper thicknesses of 1OZ and 0.5OZ, respectivement. The finished thickness of the board is 0.8mm, and it features blind holes for increased connectivity.
Caractéristiques
Key features of this PCB include:
- High-density interconnect design
- Precision trace and space measurements (3mil/3mil)
- Mechanical holes of 0.2mm and laser holes of 0.1mm
- Specialized surface treatments for enhanced durability
Production Process
The production process for an 8L 1+N+1 HDI PCB involves several steps, y compris:
- Material preparation and layer stacking
- Drilling of mechanical and laser holes
- Copper plating and etching
- Surface treatment application
- Final inspection and testing
Each step is carefully executed to ensure the highest quality and performance of the final product.
Use Cases
This PCB is commonly used in:
- Wearable technology
- Smart sensors
- Miniaturized electronic devices
- Advanced communication systems
En conclusion, the 8L 1+N+1 HDI PCB product is a state-of-the-art solution for modern micro electronic products offering unparalleled performance, reliability, and compactness.
