LOGO UGPCB
PCB HDI (2+N+2) Caractéristiques
Enhanced Capabilities for BGAs
- Smaller Ball Pitch and Higher I/O Count: Suitable for BGAs with these specifications.
Increased Routing Density
- Complex Designs: Enhances routing density in intricate designs.
Sheet Capability
- Sheet Handling: Offers robust sheet capability.
Material Quality
- Lower Dk/Df Material: Provides better signal transmission performance.
Copper Filled Vias
- Conductive Pathways: Utilizes copper filled vias for improved electrical conductivity.
Applications
Mobile Devices
- Mobile Phones: Ideal for advanced smartphones.
- PDAs: Suitable for personal digital assistants.
Computing Devices
- UMPCs: Perfect for ultra-mobile personal computers.
Gaming and Imaging
- Portable Game Consoles: Enhances the performance of handheld gaming devices.
- Digital Cameras and Camcorders: Ideal for high-resolution imaging equipment.
