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Anylayer HDI 10Layer PCB - et

PCB HDI/

Anylayer HDI 10Layer PCB

Modèle : Anylayer HDI 10Layers PCB board

Matériel:IT180A

Couche :10Layers anylayer

Couleur :Vert/Blanc

Épaisseur finie:1.6m

Épaisseur du cuivre :inner1OZ outer0.5OZ

Traitement de surface :Immersion Or + OSP

Trace minimale / Espace :2.5mil/2.5mil

Trou minimum :Mechanical hole 0.2mmLaser Hole 0.1mm

Application :Communication Products pcb

Specail Process: Anylayer hdi pcb

  • Détails du produit

Introduction to the Anylayer HDI 10Layers PCB Board

The Anylayer HDI 10Layers PCB board is a sophisticated high-density interconnect (IDH) circuit imprimé (PCB) designed for advanced communication products. This guide will cover its definition, design requirements, working principles, applications, classification, matériels, performance, structure, features, processus de production, and typical use cases.

Definition and Design Requirements

Modèle: Anylayer HDI 10Layers PCB Board
This model refers to a ten-layer PCB featuring anylayer HDI technology, allowing for complex internal layer connections.

Matériel: IT180A
The base material used is IT180A, known for its excellent thermal stability, mechanical strength, and flame resistance.

Layer Composition: 10 Layers Anylayer
This indicates a ten-layer structure with flexible internal layer connectivity, optimizing signal integrity and power distribution.

Épaisseur finie: 1.6mm
The total thickness of the finished PCB is 1.6 millimeters, ensuring durability while maintaining flexibility for various applications.

Épaisseur du cuivre: Inner 1OZ, Outer 0.5OZ
The copper traces on inner layers have a thickness of 1 ounce (once), whereas the outer layers feature a thinner 0.5 oz copper, balancing conductivity and space efficiency.

Working Principle and Purpose

Traitement de surface: Immersion Or + OSP
To enhance solderability and protect against oxidation, the PCB undergoes immersion gold plating on critical areas and organic solderability preservatives (OSP) on others.

Minimum Trace/Space: 2.5mil/2.5mil
The PCB supports fine pitch components with a minimum trace width and spacing of 2.5 milles (thousandths of an inch), facilitating compact designs without compromising performance.

Diamètre minimum du trou: Mechanical Hole 0.2mm, Laser Hole 0.1mm
It accommodates small components through mechanical drilling down to 0.2mm and even finer laser-drilled holes at 0.1mm, enabling high-density integration.

Application: Communication Products PCB
Primarily tailored for communication products, this PCB ensures reliable signal transmission and minimal interference, crucial for maintaining clear and consistent data flow in telecommunication devices.

Classification and Materials

Classification: High-Density Interconnect (IDH) PCB
As an HDI PCB, it belongs to a category of boards specifically engineered for complex electronic devices that require intricate routing and component placement.

Matériel: IT180A
IT180A is a composite material widely used in PCB manufacturing due to its balance of electrical properties, thermal resistance, et la rentabilité.

Performance and Structure

Performance: Superior Signal Integrity
With its carefully designed layer stack and use of high-quality materials, the Anylayer HDI 10Layers PCB guarantees exceptional signal integrity, reducing crosstalk and electromagnetic interference (EMI).

Structure: Multi-Layer Arrangement
The structure comprises multiple layers strategically arranged to separate power planes from signal layers, minimizing noise and enhancing overall circuit performance. The inclusion of HDI technology allows for more intricate designs within a compact form factor.

Features and Production Process

Special Features: Advanced Anylayer HDI Technology
Designed with anylayer HDI technology, this PCB offers unparalleled flexibility in internal layer connectivity, enhancing design complexity and functionality.

Production Process: Precision Manufacturing
Manufacturing begins with material selection and continues through precision drilling, plating, and laminating processes. Each step is meticulously controlled to ensure adherence to tight tolerances and high standards of quality.

Typical Use Cases and Scenarios

Typical Use Cases: Telecommunication Equipment
Commonly employed in telecommunication equipment such as routers, commutateurs, and base stations where high-speed data transmission and reliability are essential.

Usage Scenarios: High-Frequency Applications
Suitable for high-frequency applications involving wireless communication modules, including those used in modern telecommunication devices.

En conclusion, the Anylayer HDI 10Layers PCB board stands out as a sophisticated solution for demanding communication product requirements, offering unparalleled density, performance, and reliability tailored to modern telecommunication needs.

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