Communication high frequency hybrid PCB

Structure et composition

Plaque de base et couches

The high-frequency hybrid PCB splint includes a base plate, qui est plié et positionné sur la première couche de fil interne, la première couche de fil externe, and the top surface of the solder mask ink layer from bottom to top in order. The positioning circuit layer, the second outer wire layer, and the bottom surface of the substrate are also part of this structure.

High-Frequency and Auxiliary Areas

Le substrat comprend une zone haute fréquence et une zone auxiliaire. The auxiliary area is fixed, while the inlay in the high-frequency area should be located at a fixed position.

Design and Features

Division of Areas

Le modèle d'utilité fournit une attelle hybride haute fréquence, qui est divisé en deux parties: une zone haute fréquence et une zone auxiliaire. This design provides mechanical support.

High-Frequency Materials

La zone haute fréquence est disposée indépendamment, and only this area is made of high-frequency materials. This minimizes the use of high-frequency board materials while satisfying high-frequency signals, thereby reducing production costs.