LOGO UGPCB
L'attelle hybride haute fréquence comprend une plaque de base, qui est plié et positionné sur la première couche de fil interne, la première couche de fil externe, and the top surface of the solder mask ink layer from bottom to top in order. The positioning circuit layer, the second outer wire layer, and the bottom surface of the substrate follow. The substrate includes a second layer of solder resist ink. The substrate comprises a high-frequency area and an auxiliary area; the auxiliary area is fixed, and the high-frequency area inlay should be positioned accordingly.
Le modèle d'utilité fournit une attelle hybride haute fréquence, divided into two parts: une zone haute fréquence et une zone auxiliaire, providing mechanical support. The high-frequency area is independently arranged and only made of high-frequency materials. This minimizes the use of high-frequency board materials and reduces production costs while satisfying high-frequency signal requirements.
High Frequency Hybrid Product Classification:
- Calques: 6
- Planche d'occasion: RO4350B + FR4
- Épaisseur: 1.6mm
- Taille: 210mm x 280mm
- Traitement de surface: Plaqué or
- Ouverture minimale: 0.25mm
- Application: Communication
- Caractéristiques: Pression mixte haute fréquence
We provide Communication motherboard Turnkey PCB Assembly services. UGPCB est votre entreprise d'assemblage de PCB clé en main.
