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eMMC Package Substrate - et

Substrat IC/

eMMC Package Substrate

Modèle: eMMC Package Substrate

Matériel: HL832NS

Calques: 4L

Épaisseur: 0.21mm

Taille unique: 11.5 * 13mm

Soudage par résistance: PSR-4000 AUS308

Traitement de surface: Or doux

Ouverture minimale: 0.1mm

Distance minimale des lignes: 20un

Largeur de ligne minimale: 20un

Application: eMMC Package Substrate PCB Board

  • Détails du produit

Introduction to eMMC

eMMC (Embedded MultiMedia Card) is a standard specification for embedded memory established by the MMC Association, primarily targeted at mobile phone products. An evident benefit of eMMC is its integration of a controller within the package, offering a standard interface and managing flash memory. This allows mobile phone manufacturers to concentrate on other aspects of product development, thereby shortening the time-to-market for products. These attributes are equally crucial for NAND suppliers aiming to decrease the size and cost of photolithography.

Popularity and Purpose of eMMC

eMMC is currently the most prevalent local storage solution for mobile devices. Its main objective is to simplify the design of mobile phone memory. Due to the variety of NAND Flash chip brands, such as Samsung, KingMax, Toshiba, Hynix, and Micron, redesigning according to each company’s product and technical characteristics is necessary. Previously, no technology catered to all NAND Flash chips across brands.

Evolution and Impact of NAND Flash Technology on eMMC

As NAND Flash process technology evolves, from 70 nanometers to 50 nanometers, and further to 40 et 30 nanometers, mobile phone customers must redesign their products. Semiconductor products undergo annual process technology updates, often accompanied by memory issues, slowing down the launch of new mobile phone models. Consequently, the concept of eMMC, which consolidates all memory and the NAND Flash management control chip into one MCP, has gained popularity.

Design Concept and Benefits of eMMC

The design philosophy of eMMC revolves around simplifying the utilization of internal memory in mobile phones. By integrating the NAND Flash chip and control chip into a single MCP, mobile phone customers can merely purchase eMMC chips and incorporate them into new mobile phones, bypassing complex NAND Flash compatibility and management issues. The primary advantage lies in shortened time-to-market, reduced research and development costs for new products, and accelerated product innovation speeds.

Management of Flash Memory with eMMC

The manufacturing process and technology of Flash memory are rapidly evolving. Especially after TLC technology and manufacturing processes have reached the 20nm stage, managing Flash becomes a significant challenge. With eMMC products, main chip manufacturers and customers do not need to concern themselves with the internal production and product changes of Flash. Flash memory management is handled through the standard interface of eMMC, significantly reducing product development difficulty and accelerating time-to-market.

eMMC’s Comprehensive Management Capabilities

eMMC efficiently addresses the management of MLC and TLC, ECC debugging mechanisms (Error Correcting Code), block management, wear leveling storage block technology, command management, and low-power management.

Core Advantage of eMMC

The fundamental benefit of eMMC is that manufacturers can save considerable time managing NAND Flash chips. They do not need to worry about the evolution of NAND Flash chip process technology and product upgrades, nor do they have to consider which NAND Flash chip is used. In this manner, eMMC accelerates productstime-to-market, ensuring product stability and consistency.

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