LOGO UGPCB
Hybrid PCB is commonly used in microwave RF series products
Avec le développement rapide des technologies de communication électronique, in order to achieve high-speed and high-fidelity signal transmission, more and more microwave radio frequency PCBs are used in communication equipment. Les matériaux diélectriques utilisés dans les cartes de circuits hybrides haute fréquence ont d'excellentes propriétés électriques et une bonne stabilité chimique, which are mainly manifested in the following four aspects.
1. Hybrid PCB has the characteristics of low signal transmission loss, délai de transmission court, and low signal transmission distortion.
2. Excellentes propriétés diélectriques (se réfère principalement à une faible constante diélectrique relative DK, faible facteur de perte diélectrique DF). En outre, les propriétés diélectriques (NSP, DF) remain stable under environmental changes such as frequency, humidity and temperature.
3. High-precision characteristic impedance control.
4. Le PCB hybride a une excellente résistance à la chaleur (TG), processability and adaptability.
Microwave high-frequency hybrid PCBs are widely used in communication equipment such as wireless antennas, base station receiving antennas, amplificateurs de puissance, systèmes radar, navigation systems, etc..
Based on one or more factors such as cost saving, improving bending strength and controlling electromagnetic interference, high-frequency lamination design must use high-frequency prepreg with low resin flow and FR-4 substrate with smooth dielectric surface. High-frequency composite laminate. Dans ce cas, there is a great risk of product adhesion control during the pressing process.
Microwave high-frequency hybrid PCB stacking method and characteristics
1. A high-frequency hybrid PCB controllable depth composite lamination structure, le PCB hybride haute fréquence comprend une couche de cuivre L1 (feuille haute fréquence), Couche de cuivre L2 (Feuille PP), Couche de cuivre L3 (substrat en résine époxy), L4 copper layer in sequence; L2, L3, L4 copper layers are provided with slots of the same size at the same position; L4 copper layer is arranged with three-in-one buffer material from inside to outside, and steel plate and kraft paper are stacked from outside to outside in sequence; aluminum plate, steel plate, and kraft paper are stacked on L1 copper layer from inside to outside.
2. According to the first feature, the three-in-one buffer material is a buffer material sandwiched between two layers of release film.
3. According to the first feature, the laminated structure of the high-frequency board controlled deep hybrid board of the present invention is characterized in that the high-frequency sheet is a polytetrafluoroethylene board.
The expansion and contraction characteristics of the high-frequency hybrid PCB composite board are different from those of the ordinary epoxy resin substrate, so the warping and shrinkage of the board are difficult to control, and the processing method of first grooving and then pressing will cause the problem of metal dents on the board. The three-in-one buffer material is set on one side of the groove, and the buffer material can be filled into the groove hole during pressing to avoid the problem of dents. Kraft paper buffer pressure is set on both sides of the cardboard to balance the heat transfer uniformly, and the steel plate is set to ensure uniform heat conduction during pressing, so that the pressing is flat, and the heat and pressure during the pressing process are balanced, so as to better control the curvature and expansion of the board.
Avec le développement rapide de la technologie de communication 5G, higher frequency requirements are put forward for communication equipment. There are many microwave high-frequency hybrid PCBs on the market. La technologie de fabrication de ces PCB hybrides haute fréquence micro-ondes impose également des exigences plus élevées.. We have been specialized in UGPCB processing for more than 10 years and can provide multi-layer hybrid PCB manufacturing services. We have all the equipment required for the entire process of multi-layer hybrid PCB production, comply with the ISO9001-2000 international standard management system, and have passed the iatf16949 and ISO 14001 certification du système. Our products have passed UL certification and comply with IPC-A-600G and IPC-6012A standards. We can provide high-quality, high-stability, and high-adaptability microwave high-frequency hybrid PCB samples and batch services.
